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Crystal cutting device and method

A crystal cutting and circular cutting technology, which is applied to fine working devices, stone processing equipment, manufacturing tools, etc., can solve the problems of poor consistency of crystal orientation accuracy of wafers, different levels of human operation, low cutting efficiency, etc., and achieve good surface quality. , high cutting efficiency, easy to operate

Active Publication Date: 2019-04-09
BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The entire cutting process is cumbersome, coupled with factors such as different levels of human operation, the crystal orientation accuracy of wafers cut by different ingots is poor, material waste is serious, and cutting efficiency is low

Method used

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  • Crystal cutting device and method
  • Crystal cutting device and method

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Embodiment Construction

[0040] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the present invention. Obviously, the described embodiments are only part of the embodiments of the application , but not all examples. The components of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of the application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of the present ...

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Abstract

The invention provides a crystal cutting device and method, and relates to the technical field of material cutting. The crystal cutting device is characterized in that a worktable, a cutting mechanism, a crystal adjusting mechanism and a crystal orientation detecting mechanism are integrated; the crystal adjusting mechanism comprises a rotating mechanism and a pitching mechanism, the crystal orientation detecting mechanism comprises a moving table, a rotating device, a detecting device and an ampere meter, and the crystal cutting method comprises the steps that the crystal to be cut is fixed to a material disc; through the crystal adjusting mechanism, the space posture of the crystal to be cut is adjusted in the rotating orientation, and the expression of the ampere meter achieves peak value; a detecting device of the crystal orientation detecting mechanism is rotated by 90 degrees, through the crystal adjusting mechanism, the space posture of the crystal to be cut is adjusted in the pitching direction, and expression of the ampere meter achieves peak value; and the crystal adjusting mechanism is locked, and the crystal to be cut is cut. According to the crystal cutting device andmethod, the cut crystal is high in crystal orientation precision, the surface quality is good, and cutting efficiency is high.

Description

technical field [0001] The invention relates to the technical field of material cutting, in particular to a crystal cutting device and method. Background technique [0002] In the processing of artificial crystals, especially the third-generation semiconductor materials, crystal cutting technology is an important process in the crystal processing process. During the crystal cutting process, there will be crystal orientation requirements. Due to the various characteristics of crystals, people have different crystal orientation precision requirements for the use of various crystals, and different crystal planes have different hardness, elastic modulus and fracture strength during the cutting process, and the thickness difference and Warpage rates also vary considerably. [0003] The existing cutting equipment does not have a crystal orientation detection device. In the process of processing, a wafer needs to be cut first, and after the offline crystal orientation angle test i...

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Application Information

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IPC IPC(8): B28D5/04B28D5/00
CPCB28D5/0058B28D5/045
Inventor 吴学宾周立庆郝禄侯晓敏吴卿
Owner BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC
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