Coaxial active packaging structure of electric absorption modulation sealed laser

Abstract

The invention relates to the technical field of optical fiber communication, and specifically relates to a coaxial active packaging structure of an electric absorption modulation sealed laser. The coaxial active packaging structure of an electric absorption modulation sealed laser is characterized in that an electric absorption modulation laser chip and a reflective prism of the package structureare integrated on the upper surface of the heat sink inside the tube body, and the tube holder is not required for inversion during processing, thus reducing the process difficulty; and the top, awayfrom a conductive metal foot, of a cap-shaped metal casing of the tube body is provided with an adjustable metal seat of an annular sleeve structure, and a lens is inserted in an annular sleeve of theadjustable metal seat and the relative positions of the two are adjustable. The coaxial active packaging structure of the electric absorption modulation sealed laser adopts the lens separated from the tube body, and does not need to mount a light-transmitting slide plate inside the tube body, thereby reducing the patch accuracy requirement for the electric absorption modulation laser chip. Besides, as the lens can adjust the relative distance and position of the reflective prism through the adjustable metal seat, the coupling difficulty of the lens can be reduced on the active coupling.

Description

technical field [0001] The invention relates to the technical field of optical fiber communication, in particular to a coaxial active packaging structure of an electroabsorption modulation sealed laser. Background technique [0002] With the development of the optical communication industry, the demand for higher speed and longer transmission distance lasers continues to increase. Traditional lasers are mainly direct-modulated lasers using internal modulation technology. Directly modulated lasers directly modulate the light source itself according to the modulation signal, change the oscillation parameters of the laser with the modulation signal, and change the output characteristics of the laser through the change of the bias current to achieve modulation. The signal is carried out in the process of laser oscillation, which is small in size, simple in structure, easy to implement, and low in cost. However, the frequency band utilization is low. Because of the special chirp...

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Problems solved by technology

[0004] The coaxial packaging structure of electro-absorption lasers currently on the market is as follows: figure 1 As shown, there are two problems: one is that devices such as its light-emitting chip LD and capacitor need to be vertically packaged in the socket (see figure 1 In part A), when mounting the LD, it is necessary to invert the tube base first, and use a variety of solders to cooperate with the welding, which makes the process difficult; the other is that the coupling between the lens and the LD is active coupling, but the existing packaging structure The coupling device can only be adjusted in the X and Y directions on the horizontal plane, which is not conducive to optical coupling

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