Production process of bipolar light-emitting diode
A technology of light-emitting diodes and production technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of crowded portable electric drill circuits, increase the difficulty of circuit design, and increase production costs, so as to reduce production costs and share Space, the effect of reducing the amount of usage
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Embodiment 1
[0021] The production technology of embodiment 1 bipolar light-emitting diode, comprises the following steps:
[0022] 1. Chip fixation
[0023] First put LED chip fixing glue in the lamp cup of the lead bracket, use two blue light chips with a wavelength of 455-465nm, arrange them in the lamp cup of the lead bracket with opposite polarity directions, and then send them into a hot air circulation oven for baking at 150°C Curing in 80 minutes; the lead bracket is made of SPCC iron material, and the surface is silver-plated;
[0024] 2. Ultrasonic welding wire
[0025] After baking and solidifying the material, use an ultrasonic gold wire ball welding machine to connect the chip bonding pad with the bonding gold wire to the bracket welding wire area, and the two chips are connected to the two poles of the bracket in different polarity directions to form an electrical circuit;
[0026] 3. Apply fluorescent light
[0027] Pour the prepared inorganic YAG phosphor solution into t...
Embodiment 2
[0032] The production technology of embodiment 2 bipolar light-emitting diodes, comprises the following steps:
[0033] 1. Chip fixation
[0034] First, apply LED chip fixing glue in the lamp cup of the lead bracket, use two blue light chips with a wavelength of 455-465nm, arrange them in the lamp cup of the lead bracket with opposite polarity directions, and then send them into a hot air circulation oven for baking at 160°C Curing in 60 minutes; the lead bracket is made of SPCC iron material, and the surface is silver-plated;
[0035] 2. Ultrasonic welding wire
[0036] After baking and solidifying the material, use an ultrasonic gold wire ball welding machine to connect the chip bonding pad with the bonding gold wire to the bracket welding wire area, and the two chips are connected to the two poles of the bracket in different polarity directions to form an electrical circuit;
[0037] 3. Apply fluorescent light
[0038] Pour the prepared inorganic YAG phosphor solution in...
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