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Heat dissipation chassis

A chassis and cooling plate technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of ineffective effect, increased noise, and poor practicability, so as to improve the anti-seismic effect and reduce the risk of short circuit , the effect of improving practicality

Inactive Publication Date: 2019-03-15
HENAN POLYTECHNIC INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the disadvantage of this structure is that the cooling effect is not obvious by increasing the internal air circulation by adding fans, which not only consumes a lot of energy, but also increases noise, which is not very practical.
However, the layout of the water cooling system in this structure still cannot cover the defects of the entire chassis space

Method used

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Experimental program
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Effect test

Embodiment 1

[0031] Such as Figure 1 to Figure 4 As shown, the present invention discloses a heat-dissipating case, including a case 1 and a water cooling device. The front baffle of the case 1 is provided with an air inlet 2, the rear baffle is provided with an air outlet 3, the air inlet 2 adopts a louver structure, and the air outlet 3 adopts a net. Hole structure, positioning assembly 4 is provided in the housing, and positioning assembly 4 is used to install components such as motherboards and disks;

[0032] The water cooling device includes a water flow assembly arranged inside the housing 1 and a water tank 5 and a water pump 6 arranged outside the housing 1. The water flow assembly includes a circulating water pipe 7 arranged on the right baffle of the housing 1 and a heat dissipation plate arranged near the air inlet 2 , The circulating water pipe 7 and the radiating plate are fixed on the housing 1 by a clamp 8. The radiating plate includes a lower water inlet pipe 9, an upper wat...

Embodiment 2

[0034] The invention discloses a heat-dissipating case, comprising a case 1 and a water cooling device. The front baffle of the case 1 is provided with an air inlet 2, and the rear baffle is provided with an air outlet 3. The air inlet 2 adopts a louver structure, and the air outlet 3 adopts a mesh structure. , A positioning component 4 is provided in the housing, and the positioning component 4 is used to install components such as motherboards and disks;

[0035] The water cooling device includes a water flow assembly arranged inside the housing 1 and a water tank 5 and a water pump 6 arranged outside the housing 1. The water flow assembly includes a circulating water pipe 7 arranged on the right baffle of the housing 1 and a heat dissipation plate arranged near the air inlet 2 , The circulating water pipe 7 and the radiating plate are fixed on the housing 1 by a clamp 8. The radiating plate includes a lower water inlet pipe 9, an upper water outlet pipe 10 and a radiating fin 1...

Embodiment 3

[0038] The invention discloses a heat-dissipating case, comprising a case 1 and a water cooling device. The front baffle of the case 1 is provided with an air inlet 2, and the rear baffle is provided with an air outlet 3. The air inlet 2 adopts a louver structure, and the air outlet 3 adopts a mesh structure. , A positioning component 4 is provided in the housing, and the positioning component 4 is used to install components such as motherboards and disks;

[0039] The water cooling device includes a water flow assembly arranged inside the housing 1 and a water tank 5 and a water pump 6 arranged outside the housing 1. The water flow assembly includes a circulating water pipe 7 arranged on the right baffle of the housing 1 and a heat dissipation plate arranged near the air inlet 2 , The circulating water pipe 7 and the radiating plate are fixed on the housing 1 by a clamp 8. The radiating plate includes a lower water inlet pipe 9, an upper water outlet pipe 10 and a radiating fin 1...

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Abstract

The invention belongs to the technical field of computer equipment, in particular a cooling chassis, includes a housing and a water cooling device, the housing is provided with an air inlet and an airoutlet, the water cooling device comprises a water flow assembly arranged inside the housing and a water tank and a water pump arranged outside the housing, A water flow assembly includes a circulating water pipe disposed on at least one side of the left and right sides of the housing and a heat dissipation plate disposed close to the air inlet, The radiating plate comprises a plurality of radiating fins arranged in communication, one end of the circulating water pipe is communicated with the water tank, the other end of the circulating water pipe is communicated with the upper end of the radiating plate, and the lower end of the radiating plate is connected with the water outlet of the water pump. The invention combines the two cooling mechanisms to effectively reduce the temperature inthe chassis, and the cooling water adopts the mode of down-going in and up-going out, so that the noise is small.

Description

Technical field [0001] The invention belongs to the technical field of computer equipment, in particular to a heat dissipation case. Background technique [0002] Looking at the development history of personal computers, as a part of computer accessories, the main role of the case is to place and fix various computer accessories, and play a supporting and protective role. In addition, the computer case plays an important role in shielding electromagnetic radiation. Although there are many types of chassis on the market, according to the actual use of the chassis, its main performance evaluation is two major parts: heat dissipation and electromagnetic shielding. [0003] The case generally includes a case, a bracket, various switches, indicators, etc. on the panel. The case mainly protects the internal components of the case, and the bracket is mainly used to fix the motherboard, power supply and various drives. The new research direction for the case is focused on the ventilation...

Claims

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Application Information

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IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/182G06F1/20
Inventor 王林生王臻卓马茵董珍珍李仁邱兵涛
Owner HENAN POLYTECHNIC INST
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