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Chip testing device

A chip test, chip technology, applied in the field of testing, can solve the problems of short service life of the controller, inaccurate measurement of temperature measurement components, etc., to achieve the effect of prolonging service life, improving flexibility and ensuring accuracy

Pending Publication Date: 2019-03-12
上海捷策创电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on the above, the object of the present invention is to provide a chip testing device to solve technical problems such as the short service life of the controller and the inaccurate measurement of the temperature measuring component in the existing chip testing device.

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Embodiment Construction

[0038] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only the technical solutions of the present invention. Some, but not all, embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.

[0039] Such as Figure 1-Figure 3 As shown, this embodiment provides a chip testing device, including a test socket assembly 1, a heating assembly 2, a temperature measurement assembly 3 and a peripheral controller 4, wherein the test socket assembly 1 includes a fixing plate assembly 11 and a conductive member 12 , the chip 10 is arranged in the...

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Abstract

The invention relates to the technical field of testing, and discloses a chip testing device. The device comprises a testing seat assembly, a heating assembly, a temperature measuring assembly and a controller, wherein the testing seat assembly comprises a fixing plate assembly and a conductive member, part of the heating assembly is arranged in the fixing plate assembly, the temperature measuringassembly can slidably penetrates through the heating assembly and can be in contact with the chip to measure the temperature of the chip, the externally arranged controller and the testing seat assembly are arranged at intervals, the externally arranged controller is electrically connected with the heating assembly and the temperature measuring assembly, and the externally arranged controller comprises a display module and used for inputting a preset temperature and displaying a temperature measuring result. The chip testing device has the advantages that the externally arranged controller and the display module operate at room temperature, so that the service life of the externally arranged controller and the display module is prolonged, and the preset temperature can be adjusted in thetesting process to improve the flexibility of temperature control; in addition, the direct measuring on the temperature of the chip can be achieved by the temperature measuring assembly, and thereforethe measuring accuracy is improved.

Description

technical field [0001] The invention relates to the technical field of testing, in particular to a chip testing device. Background technique [0002] In order to ensure the performance of the chip at a high temperature, it is usually necessary to use a chip testing device with a heating function to perform a high temperature test on the chip. Existing chip testing devices with heating function usually include a heating component, a temperature measuring component and a controller, use the heating component to heat the chip, use the temperature measuring component to measure the chip temperature, and use the controller to control the on or off The power supply for heating components to control the temperature of the chip. [0003] However, the controller in the existing chip testing device is generally directly installed in the device. As the heating element heats the chip, the temperature of the controller will also increase accordingly, so that the controller can work at a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
CPCG01R31/2875
Inventor 蒋卫兵王坚
Owner 上海捷策创电子科技有限公司
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