A non-lithographic method for mechanical assembly and molding of mesoscopic-scale structures

Abstract

The invention provides a non-photolithographic mesoscopic scale structure mechanical assembling and forming method used for obtaining a mesoscopic scale three-dimensional target configuration. The method comprises the following steps: a design step of designing a two-dimensional precursor structure corresponding to the target configuration and a pre-stretching dependent variable of an assembly platform used for forming the target configuration with the two-dimensional precursor structure through mechanical assembling and forming; a manufacturing step of cutting a two-dimensional planar material through femtosecond laser to form the two-dimensional precursor structure; a mechanical assembling and forming step of fixing the two-dimensional precursor structure at the assembly platform havingthe pre-stretching dependent variable, releasing the assembly platform to enable the two-dimensional precursor structure to at least partially flex and deform, and consequently forming the target configuration. The preparation method has high processing precision and is suitable for various high-performance materials, can efficiently and economically produce the mesoscopic scale structure with less chemical reagent, is environmental-friendly, and can be compatible to a semiconductor manufacturing technology.

Description

technical field [0001] The present disclosure relates to the technical field of micro-nano processing, and in particular to a non-photolithographic mesoscale structural mechanics assembly method. Background technique [0002] The complex three-dimensional structure of the mesoscopic scale (between macroscopic and microscopic, generally considered between nanometer and millimeter) widely exists in biological systems such as cytoskeleton, neural network, and vascular network, and undertakes the most basic functions of living organisms . On the other hand, mesoscopic-scale microstructured devices have a wide range of applications in biomedical devices, microelectromechanical systems, metamaterials, energy storage devices, photoelectric sensor devices, etc. Therefore, the manufacture of mesoscopic three-dimensional structures has always been the focus and frontier of scientific and technological research. [0003] In the past ten years, the mesoscopic three-dimensional structu...

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Problems solved by technology

[0005] First, the applicability of these processes is not strong, and is limited by materials and product configurations. For example, the laser direct writing process is limited by photosensitive materials, and the 3D printing process is limited by polymer materials, metal powder melting, and residual stress bending assembly processes. limited by molding structures, etc.;

[0006] Second, the efficiency of these processes is low;

[0007] Third, these processes require the use of a large amount of chemical reagents in the implementation process, and most of them are toxic, making it difficult to be environmentally friendly;

[0008] Fourth, these processes are difficult to be compatible with semiconductor manufacturing processes

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