Fluorescent thin film structure for LED, preparation method thereof, and luminescent light source

A thin-film structure and fluorescence technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of phosphor deposition in dispensing process, avoid inconsistent dispensing uniformity, simple preparation method, and improve light color consistency Effect

Active Publication Date: 2020-04-28
NINGBO LONGER LIGHTING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, in the process of realizing the above technical solution, the inventors of the present application found that there was a technical problem of phosphor precipitation in the dispensing process.

Method used

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  • Fluorescent thin film structure for LED, preparation method thereof, and luminescent light source
  • Fluorescent thin film structure for LED, preparation method thereof, and luminescent light source
  • Fluorescent thin film structure for LED, preparation method thereof, and luminescent light source

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Embodiment 1

[0060] see figure 1 with figure 2 , the invention discloses a fluorescent film structure for LEDs, comprising a first transparent film 1; phosphor powder 2 coated on the upper surface of the first transparent film 1; and a second transparent film 3 attached to the phosphor powder 2 The upper surface of the first transparent film 1.

[0061]Since the density of the phosphor 2 is greater than that of the adhesive, under the action of gravity, the phosphor 2 precipitates and is not evenly distributed in the adhesive, resulting in a change in the concentration distribution of the phosphor adhesive. In addition, during the dispensing process, it is difficult to keep the concentration of phosphor 2 consistent from beginning to end. Phosphor 2 is mixed in the adhesive to maintain a certain particle size. During the dispensing process, the dispensing cylinder is placed vertically. A certain viscosity, but the density of phosphor 2 is greater than the density of the adhesive, phosph...

Embodiment 2

[0069] refer to image 3 , the present invention also discloses a method for preparing a fluorescent film structure for LEDs, comprising:

[0070] S1: Obtain the first transparent film 1;

[0071] S2: obtaining the second transparent film 3;

[0072] S3: coating the phosphor powder 2 on the upper surface of the first transparent film 1;

[0073] S4: attaching the second transparent film 3 to the upper surface of the first transparent film 1 in step S3 to form a fluorescent film structure for LED;

[0074] Step S1 and step S2 can be performed at the same time, and the order of step S2 and step S3 can be exchanged.

[0075] Specifically, step S1 includes:

[0076] S101: Weigh the first adhesive, and perform vacuum defoaming treatment on the first adhesive;

[0077] S102: Prepare a first transparent film-like adhesive on the substrate by using the first adhesive after vacuum degassing in step S101 by a spin coating method;

[0078] S103: Curing the first transparent film-li...

Embodiment 3

[0111] The invention also discloses an LED luminescent light source, which includes a fluorescent thin film structure for the LED. Encapsulating the fluorescent film structure into the LED light source can improve the light color consistency of the LED.

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Abstract

The invention relates to a fluorescent thin film structure for an LED, a preparation method thereof and a light-emitting light source. The fluorescent thin film structure for an LED comprises a firsttransparent thin film, phosphor powder applied on the upper surface of the first transparent thin film and a second transparent thin film bonded to the first transparent thin film coated with the phosphor powder. The preparation method of the fluorescent thin film structure for an LED includes: obtaining a first transparent thin film, obtaining a second transparent thin film, applying phosphor powder on the upper surface of the first transparent thin film, and bonding the second transparent thin film to the upper surface of the first transparent thin film coated with the phosphor powder. An LED light-emitting light source includes the fluorescent thin film structure for an LED. The invention solves the problems of fluorescent powder precipitation and poor consistency of light and color inthe packaging process, meanwhile shortens the packaging process and reduces the production cost.

Description

technical field [0001] The invention relates to the field of LED packaging, in particular to a fluorescent film structure for LEDs, a preparation method thereof and a light emitting source. Background technique [0002] In the context of the increasingly serious global energy crisis, white LEDs, as a new type of solid light source, have attracted widespread attention due to their advantages such as small size, long life, energy saving, environmental protection, and high light efficiency. They are considered to be the third generation of lighting technology and are widely used. It is widely used in large-screen display, landscape lighting, street lighting, indoor lighting, traffic lights and other fields. LED packaging is an important part of the LED industry. [0003] At present, the dispensing method is a commonly used choice in the packaging process of industrialized white light LEDs, that is, the adhesive and phosphor are fully and evenly mixed together, placed in a vacu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/50
CPCH01L33/505H01L33/507H01L2933/0041
Inventor 邹军钱幸璐石明明
Owner NINGBO LONGER LIGHTING
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