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Packaging component

A technology of packaging components and packaging substrates, which is applied in the direction of electrical components, semiconductor devices, circuits, etc., can solve the problems of poor packaging stability of light-emitting diodes, and achieve the effect of improving packaging stability

Active Publication Date: 2019-02-22
XIAMEN CHANGELIGHT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, the packaging stability of light-emitting diodes is poor at present

Method used

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Embodiment Construction

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0038] refer to figure 1 , figure 1 It is a structural schematic diagram of a package assembly in the prior art, wherein a light emitting diode 11 generally includes a P electrode and an N electrode, and a P pad 13 and an N pad 14 are respectively extended from the P electrode and the N electrode. The substrate 12 corresponding to the soldered LED 11 also includes a P sub-pad 15 and an N sub-pad 16 that are independent of each other.

[0039] During solderin...

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Abstract

The present invention provides a packaging component. The packaging component includes: a light emitting diode and a packaging substrate; the light emitting diode includes first pads; the packaging substrate includes second pads; the light emitting diode and the packaging substrate are fixedly connected through the first pads and the second pads; the number of the first pads and the number of thesecond pads are identical; and the number of the first pads is at least three. The number of the first pads in the packaging component is at least three, and the number of the second pads is the sameas the number of the first pads. Then, the three or more pads generate tension in multiple directions, and in this way, a position of the light emitting diode can be aligned with a position of the packaging substrate are aligned, and an offset or skew can be prevented; and the packaging stability of the light emitting diode is improved.

Description

technical field [0001] The present invention relates to the technical field of semiconductor device packaging, and more specifically, to a packaging assembly. Background technique [0002] With the continuous development of science and technology, various light-emitting diodes have been widely used in people's daily life, work and industry, bringing great convenience to people's life. [0003] However, the packaging stability of light emitting diodes is poor at present. Contents of the invention [0004] In view of this, in order to solve the above problems, the present invention provides a packaging assembly, the technical solution is as follows: [0005] A package assembly, comprising: a light emitting diode and a package substrate; [0006] The light emitting diode includes a first pad; the packaging substrate includes a second pad; [0007] The light emitting diode and the package substrate are fixedly connected through the first pad and the second pad; [0008] Th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/62
CPCH01L33/48H01L33/62
Inventor 柯志杰李希柯毅东陈冬芳林志伟
Owner XIAMEN CHANGELIGHT CO LTD
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