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Elastic membrane, substrate holding device, and polishing apparatus

A substrate holding and elastic film technology, applied in the field of elastic film, can solve the problems of film coverage (step-type coverage deterioration, etc., to achieve the effect of easy pressure control and inhibition of expansion)

Active Publication Date: 2019-02-22
EBARA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to achieve circuit miniaturization and realize multi-layer wiring, the level difference is larger due to the surface unevenness along the lower layer. Therefore, as the total number of wiring increases, the film coverage of the step shape (step Jump Coverage) Deterioration

Method used

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  • Elastic membrane, substrate holding device, and polishing apparatus
  • Elastic membrane, substrate holding device, and polishing apparatus
  • Elastic membrane, substrate holding device, and polishing apparatus

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Embodiment Construction

[0202] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the embodiment described below is an example at the time of carrying out this invention, and does not limit this invention to the concrete structure demonstrated below. When the present invention is implemented, specific structures corresponding to the embodiments may also be appropriately adopted.

[0203] figure 1 It is a figure which shows the grinding|polishing apparatus of embodiment. Such as figure 1 As shown, the polishing apparatus includes: a polishing table 18 supporting a polishing pad 19 ; and a substrate holding device 1 holding a wafer W as an example of a substrate to be polished and pressing the polishing pad 19 on the polishing table 18 . In the following description, the substrate holding device 1 is referred to as a polishing head 1 .

[0204] The grinding table 18 is connected to a table motor 29 arranged below it via a table shaft 1...

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Abstract

Provided is an elastic membrane, precisely adjusting a polishing profile with respect to an edge portion of a substrate. The elastic membrane comprises: a contact unit (11) allowing the elastic membrane (10) used for a polishing head (1) to come in contact with a wafer (W); a circular side wall (15) installed on the end portion of an outer circumfernece of the contact unit (11) in a standing state; a first partition wall (14f) linearly extending from the side wall (15) inward in the diameter direction when viewed from a cross-section; a second partition wall (14e) linearly extending upward from the end portion of the outer circumfernece of the contact unit (11) to the insdie of the diameter direction when veiwed from the cross-section; and an edge press chamber (16f) pressing the edge of the wafer (W) by the first parition wall (14f), the second partition wall (14e), and the side wall (15).

Description

technical field [0001] The present invention relates to a grinding device for grinding a substrate such as a wafer, a substrate holding device for holding a substrate in the grinding device, and an elastic film used for the substrate holding device. Background technique [0002] In recent years, as semiconductor devices have become more integrated and denser, circuit wiring has become more miniaturized, and the total number of multilayer wiring has also increased. In order to achieve circuit miniaturization and realize multi-layer wiring, the level difference is larger due to the surface unevenness along the lower layer. Therefore, as the total number of wiring increases, the film coverage of the step shape (step jump coverage) worsens. Therefore, in order to realize multilayer wiring, it is necessary to improve the step coverage and planarize with an appropriate process. In addition, since the depth of focus becomes shallower with the miniaturization of photolithography, ...

Claims

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Application Information

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IPC IPC(8): B24B37/00B24B37/005B24B37/34
CPCB24B37/00B24B37/005B24B37/34
Inventor 山木晓福岛诚并木计介锅谷治富樫真吾大和田朋子加藤良和
Owner EBARA CORP
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