Wing-shaped lead SOP (small outline package) device and technological method for forming leads of wing-shaped lead SOP device

Abstract

The invention discloses a wing-shaped lead SOP (small outline package) device and a technological method for forming leads of the wing-shaped lead SOP device. An end of each lead is fixed to a pin ofthe wing-shaped lead SOP device, and the leads are sequentially divided into oblique downward sections, horizontal sections, vertical sections and oblique sections from fixed ends to free ends; the oblique downward sections and the horizontal sections extend towards the outer sides of the wing-shaped lead SOP device and are in bending transition with one another, the vertical sections are in circular arc transition with the horizontal sections and the oblique sections, the oblique sections are horizontally downwardly oblique, and the leads are symmetrically arranged at two ends of the wing-shaped lead SOP device. The wing-shaped lead SOP device and the technological method have the advantages that stress relief spaces for the leads of the wing-shaped lead SOP device can be enlarged and canbe obviously increased, accordingly, the failure rate of the wing-shaped lead SOP device under long-term shear stress and high-temperature creep effects can be effectively lowered, and the post-weldreliability of the wing-shaped lead SOP device further can be improved.

Description

technical field [0001] The invention belongs to the field of safety and reliability of electronic components, and relates to an airfoil lead SOP device and a process method for forming the lead. Background technique [0002] As the use of domestic SOP package bottom-leading devices is becoming more and more widespread, the resulting soldering reliability problems are becoming more and more prominent. The lead extension method of the domestic SOP package bottom lead-out device is the bottom lead-out type. The device lead has no shoulder, and the stress is too small to release the space. Relevant forming requirements of 3171 "Technical Requirements for Forming Components of Aerospace Electronic and Electrical Products". [0003] After direct soldering of this type of device, due to the lack of lead stress release space, under the continuous action of environmental stress, the device body and soldering materials are subjected to shear stress and high temperature creep for a lo...

AI Technical Summary

Problems solved by technology

The lead extension method of the domestic SOP package bottom lead-out device is the bottom lead-out type. The device lead has no shoulder, and the stress is too small to release the space. Relevant forming requirements of 3171 "Technical Requirements for Forming Components of Aerospace Electronic and Electrical Products"

[0003] After this type of device is directly soldered, due to the lack of lead stress release space, under the continuous action of environmental stress, the device body and soldering materials are subject to shear stress and high temperature creep for a long time, resulting in the risk of stress cracking failure

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