optical module

An optical module and optical interface technology, applied in the field of optical modules, can solve problems such as module failure, chip performance degradation, failure, etc., to reduce the impact of signal crosstalk, efficient heat dissipation, and increase the distance.

Active Publication Date: 2019-11-29
INNOLIGHT TECHNOLOGY (SUZHOU) LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although highly integrated circuits are working towards miniaturization and low power consumption, with the development of high-speed and high-bandwidth module technology, the high thermal power consumption of the module has become a problem that must be faced. If a better heat dissipation effect cannot be guaranteed, The performance of the temperature-sensitive electro-optic / photoelectric conversion components and chips in the optical module will be greatly reduced, and even cause the entire module to fail to work or fail

Method used

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Embodiment Construction

[0033] The application will be described in detail below in conjunction with specific implementations shown in the accompanying drawings. However, these implementations do not limit the present application, and any structural, method, or functional changes made by those skilled in the art based on these implementations are included in the protection scope of the present application.

[0034] In each drawing of the present application, some dimensions of structures or parts are exaggerated relative to other structures or parts for convenience of illustration, and therefore, are only used to illustrate the basic structure of the subject matter of the present application.

[0035] In addition, terms used herein such as "upper", "above", "under", "below", etc. to express relative positions in space are for convenience of description to describe a unit or feature as shown in the drawings relative to A relationship to another cell or feature. The terms of spatial relative position ...

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Abstract

The present invention discloses an optical module. The optical module includes a housing, a heat sink device disposed in the housing and thermally connected to the housing, and a printed circuit board partially disposed on the heat sink device. Wherein, the optical module further includes a first optoelectronic chip and a second optoelectronic chip both disposed on the heat sink device, the first optoelectronic chip and the second optoelectronic chip are both electrically connected to the printed circuit board, The printed circuit board has a first surface, a second surface opposite to the first surface, and an opening penetrating from the first surface to the second surface, and the second photoelectric chip is arranged in the opening part, and the second optoelectronic chip is set separately from the first optoelectronic chip. The optical module has efficient heat dissipation capability, and reduces the signal crosstalk effect between the first optoelectronic chip and the second optoelectronic chip.

Description

technical field [0001] The invention relates to the technical field of manufacturing optical communication components, in particular to an optical module. Background technique [0002] With the rapid development of 4G communication and the increasing demand for cloud computing, the market demand for high-speed optical modules is increasing day by day. In response to the market's demand for high-bandwidth and high-speed data transmission, module design is increasingly developing in the direction of miniaturization and high density. Although highly integrated circuits are working towards miniaturization and low power consumption, with the development of high-speed and high-bandwidth module technology, the high thermal power consumption of the module has become a problem that must be faced. If a better heat dissipation effect cannot be guaranteed, Then the performance of the temperature-sensitive electro-optic / photoelectric conversion components and chips in the optical module...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH04B10/40H05K7/20436G02B6/4272H05K1/021H05K2201/10121G02B6/4273H05K1/0216H05K1/0274
Inventor 陈龙孙雨舟于登群
Owner INNOLIGHT TECHNOLOGY (SUZHOU) LTD
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