Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Heat treatment device for semiconductor integrated wafer production

A heat treatment device and integrated wafer technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of uneven heating, operator burns, affecting the quality of semiconductor integrated wafers, etc., to avoid burns, operation Simple, avoids the effect of uneven heating

Active Publication Date: 2021-07-23
容泰半导体(江苏)有限公司
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] As a kind of semiconductor material, semiconductor integrated wafers need to be heat treated during production. When common heat treatment devices heat semiconductor integrated wafers, it is easy to cause uneven heating, which affects the quality of semiconductor integrated wafers, and , after the production of semiconductor integrated wafers is completed, it is necessary to take out the semiconductor integrated wafers from the heating device for cooling. In this process, it is very easy to cause the operator to be scalded

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat treatment device for semiconductor integrated wafer production
  • Heat treatment device for semiconductor integrated wafer production
  • Heat treatment device for semiconductor integrated wafer production

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0021] see Figure 1-5 , the present invention provides a technical solution: a heat treatment device for semiconductor integrated wafer production, including a base 1, an outer cylinder 2 is welded to the top of the base 1, and an inner cylinder 3 is arranged inside the outer cylinder 2 , the inner top of the inner cylinder 3 is clamped with a top cover 4, and the bottom end of the top cover 4 is connected with a top plate 7 through a connecting rod 5, and th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a heat treatment device for the production of semiconductor integrated wafers. There is a top cover, the bottom end of the top cover is connected with a top plate through a connecting rod, a telescopic rod is welded on the lower surface of the top plate, the bottom end of the telescopic rod is fixedly installed with a bottom plate through a first bearing, and the bottom plate and the outer side of the top plate are equal Three sets of sliders are welded at an angle, and the inner wall of the inner cylinder is provided with a chute corresponding to the sliders. The present invention heats the semiconductor integrated wafer by adding a motor and an electric heating net, and the motor can make the semiconductor integrated circular The wafer is rotated to avoid uneven heating of the semiconductor integrated wafer. The operator can remove the semiconductor integrated wafer from the inner cylinder by moving the top cover. The operation is simple and avoids the operator being scalded.

Description

technical field [0001] The invention relates to the technical field of semiconductor materials, in particular to a heat treatment device for semiconductor integrated wafer production. Background technique [0002] Semiconductors refer to materials whose conductivity is between conductors and insulators at room temperature. Semiconductors are widely used in radios, televisions and temperature measurement. For example, a diode is a device made of a semiconductor. A semiconductor refers to a material whose conductivity can be controlled and ranges from an insulator to a conductor. Whether from the perspective of technology or economic development, the importance of semiconductors is very huge. Most of today's electronic products , such as computers, mobile phones or digital recorders, the core units are closely related to semiconductors. Common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is among various semiconductor materials. It i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/687
CPCH01L21/67109H01L21/68735
Inventor 黄家仓
Owner 容泰半导体(江苏)有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products