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A buckling temperature analysis method of plate structure considering force load

An analysis method and plate structure technology, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve the problems of not considering the influence of temperature characteristics, affecting the buckling temperature of the plate structure, and not being able to accurately obtain the actual buckling temperature. Achieve the effect of improving the accuracy of buckling temperature analysis

Active Publication Date: 2019-01-15
SOUTHEAST UNIV
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Problems solved by technology

The buckling temperature analysis of plate structures under thermal environment has a clear guiding significance for structural design, but the traditional buckling temperature calculation method does not consider the influence of temperature on the structural material properties, and only obtains the buckling factor through one calculation to calculate the buckling temperature
The traditional buckling temperature calculation method cannot accurately obtain the actual buckling temperature of the structure
On the other hand, the plate structure is often subjected to force loads at the same time in the thermal environment, and the structural displacement caused by the force load often has a significant impact on the structural stiffness, which in turn affects the buckling temperature of the plate structure.

Method used

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  • A buckling temperature analysis method of plate structure considering force load
  • A buckling temperature analysis method of plate structure considering force load
  • A buckling temperature analysis method of plate structure considering force load

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Embodiment Construction

[0029] The technical solution of the present invention will be further described below in conjunction with the accompanying drawings.

[0030] like figure 1 As shown, the present invention provides a method for analyzing the buckling temperature of a plate structure considering the force load, comprising the following steps:

[0031] (1) According to the structural material parameters under the initial force load and thermal load environment, calculate the structural linear stiffness matrix and thermal stress stiffness matrix considering the thermal effect, and then calculate the structural displacement of the plate structure under the force load; the specific calculation of structural displacement The steps are: first determine the material parameters corresponding to the structure according to the initial thermal load environment, and establish the structural linear stiffness matrix K L , the calculation formula is as follows:

[0032]

[0033] where B L is the linear ...

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Abstract

The invention discloses a buckling temperature analysis method of a plate structure considering a force load, which calculates a linear stiffness matrix and a thermal stress stiffness matrix of the structure considering a thermal effect, and calculates a structural displacement of the plate structure under the action of the force load. Linear stiffness matrix and nonlinear stiffness matrix of plate structure considering structural deformation are established, and the stiffness matrix of structural thermal stress under given thermal load is calculated. The buckling factor is calculated and thebuckling temperature of the plate is obtained. The error between the calculated buckling temperature and the given heat load is calculated, if the error value is within the allowable range, the finalbuckling temperature of the plate structure is equal to the obtained buckling temperature, otherwise, the obtained buckling temperature is taken as a new given heat load, the structural material parameters corresponding to the temperature are updated, and the buckling temperature of the plate structure considering the force load is recalculated until the final buckling temperature of the plate structure is obtained. The invention can effectively improve the analysis precision of the buckling temperature of the plate structure under the complex environment.

Description

technical field [0001] The invention relates to a buckling temperature analysis method of a plate structure, in particular to a buckling temperature analysis method of a plate structure considering force load. Background technique [0002] Plate structures are widely used in engineering structures and face complex load environments during service. Buckling analysis is an important part of structural characteristic analysis, which provides an important basis for structural design. The buckling temperature analysis of plate structures under thermal environment has a clear guiding significance for structural design, but the traditional buckling temperature calculation method does not consider the influence of temperature on the structural material properties, and only obtains the buckling factor through one calculation to calculate the buckling temperature. The traditional buckling temperature calculation method cannot accurately obtain the actual buckling temperature of the s...

Claims

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Application Information

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IPC IPC(8): G06F17/50
CPCG06F30/17G06F30/23G06F2119/06G06F2119/08
Inventor 吴邵庆杨轩费庆国李彦斌陈强
Owner SOUTHEAST UNIV
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