A vehicle-mounted multimedia electronic system with a heat dissipation function
A vehicle-mounted multimedia and electronic system technology, applied in the field of vehicle-mounted multimedia products, can solve problems such as damage to electronic components, shorten service life, and affect system performance, so as to achieve the effect of improving stability and reliability and suppressing the rise of internal temperature
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Embodiment 1
[0017] Such as figure 1 As shown, this embodiment provides a vehicle-mounted multimedia electronic system with heat dissipation function, including a PCB circuit board, heat dissipation components and electronic components. Electronic components include digital logic components, power supply components and high heat consumption components. Among them, digital logic components include CPU, MCU and other electronic components that are critical to system performance; power supply components include DC-DC, LDO and other components that generate moderate heat during operation. Electronic components; high heat consumption components include electronic components such as power amplifiers.
[0018] Divide the PCB circuit board into four areas arranged side by side: digital logic component partition 1, power supply component partition 2, high heat consumption component partition 3 and heat dissipation component zone 4, where power supply component partition 2 is located in digital logi...
Embodiment 2
[0021] This embodiment provides a vehicle-mounted multimedia electronic system with heat dissipation function, including a PCB circuit board, heat dissipation components and electronic components. Electronic components include digital logic components, power components and high heat dissipation components.
[0022] Divide the circuit board into four areas arranged side by side: Digital Logic Component Partition 1, Power Component Partition 2, High Heat Consumption Component Partition 3, and Heat Dissipation Component Partition 4. Among them, the power element partition 2 is located between the digital logic element partition 1 and the high heat consumption element partition 3, and isolates the digital logic element partition 1 from the high heat consumption element partition 3, which can effectively prevent the high heat consumption element from affecting the working performance of the digital logic element. Influence: the high heat consumption element partition 3 is adjacent ...
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