Synergistic Environment of Electrical, Thermal and Mechanical Properties of Electronic Product Packaging

Abstract

The invention discloses a novel synergistic environment including electrical, thermal and mechanical characteristics considering electronic product packaging. The invention is characterized in that alumped design platform provides comprehensive, accurate and reconfigurable design parameters, performance and function prediction for the electrical, thermal and mechanical characteristics of the electronic product package. By considering the effect of packaging, thermal and mechanical properties on product performance, the product performance can be optimized from the aspects of core design optimization, packaging optimization, thermal optimization, and mechanical design optimization according to the design cost and complexity of realization in the design stage of product. On the one hand, itguarantees the low cost realization of product performance; on the other hand, it provides multiple design degrees of freedom, reduces the complexity of performance realization, and most importantly,it can accurately evaluate the expectation of product performance in the product design stage, and reduces the design iteration.

Description

technical field [0001] The invention relates to the fields of packaging design for electronic circuits, automation of electronic circuit design, and computer aided design of electronic circuits. Background technique [0002] With the continuous advancement of electronic technology and integrated circuit technology, the clock rate of digital systems is getting higher and higher, and the signal edge rate is getting faster and faster. From the perspective of electrical performance, the interconnection between high-speed signals is no longer smooth and transparent. The impact of PCB wire interconnection and board layer characteristics on the system can no longer be simply ignored. There are gold wires, metal wires on the substrate, vias and corners, stubs, solder balls, etc. in the package interconnection. In low-frequency signals, they are often regarded as simple transmission lines. When the operating frequency of the system is high, the wire interconnecting the devices shoul...

AI Technical Summary

Problems solved by technology

When the operating frequency of the system is high, the wire interconnecting the devices should no longer be regarded as a simple wire transparent to the signal, but a parasitic element with time delay and instantaneous impedance distribution, which will cause delay and cause signal waveform distortion , interference, etc.

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