Floating base substrate for chip semiconductor testing

Abstract

The invention discloses a floating base substrate and method for chip semiconductor testing. The floating base substrate at least comprises a substrate provided with at least one same detection cavity, wherein the radius of the upper opening of each detection cavity is greater than the radius of the lower opening, a welding ball used for accommodating to-be-detected products, at least one test probe fixed to the base and adopting an elastic telescopic rod structure, wherein the tops of the test probes can extend into the detection cavity and can move up and down, and the base can be driven tomove up and down by the test probes. Power testing can be conducted by test probe being contact with welding ball. When the detected welding ball falling off caused by virtual welding defect is extruded and deformed, sequential testing is conducted, and whether the welding ball is normal is judged according to the damage surface. The structural model is based on spherical contact array package andvirtual welding. The damage risk of the welding ball is determined by calculating spherical contact array package parameters and mechanical interference of the design size of floating base.

Description

technical field [0001] The invention relates to a testing technology of a semiconductor chip, in particular to a floating base substrate and a method for chip semiconductor testing. Background technique [0002] Wet soldering is a common failure condition for ball contact array packages. As shown in Figure 1, in this case, since the ball of the solder ball does not form a metal bond under the action of the substrate, it will fall off under the action of mechanical external force during the test. The dislodged solder balls will get stuck on the floating pedestal, and there are instances during testing of ball contact array packages with subsequent damage not detected. The above test process includes PPV test, and electrical performance test. [0003] In a large-scale mass production environment, it is difficult to completely eliminate the problem of virtual soldering of the ball contact array, and the traditional assembly and testing process can only detect the problem thro...

AI Technical Summary

Problems solved by technology

However, in this type of testing method in the prior art, there will be a certain delay from the test to the back-track inspection, that is, only when the downstream chip unit reaches the back-track step of the test, the defective chip unit can be detected, so that there will be Conditions that have affected the quality of hundreds of thousands of chip units

[0005] Therefore, it can be seen that the traditional solution only minimizes the scope of influence of virtual welding, but cannot really solve the damage caused by virtual welding

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