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Stacked chip packaging structure based on special-shaped resin gasket

A chip packaging structure and resin technology, applied in electrical components, electric solid state devices, circuits, etc., can solve the problems of fragile silicon-based wafer gaskets, consumption of auxiliary materials, and high production costs, achieving unlimited thickness and flexibility. Good, easy-to-save effects

Pending Publication Date: 2018-12-11
SU ZHOU DREAM TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is: in order to solve the large package size of the existing chip stack package structure, and the fragile silicon-based wafer gasket used for chip package, high production cost, long processing technology, and consumption of auxiliary materials Problem, provide a stacked chip packaging structure based on special-shaped resin spacers

Method used

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  • Stacked chip packaging structure based on special-shaped resin gasket
  • Stacked chip packaging structure based on special-shaped resin gasket

Examples

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Effect test

Embodiment 1

[0039] This embodiment provides a stacked chip packaging structure based on a special-shaped resin pad, as shown in Figure 1, including a circuit board 2, a first adhesive layer 7, a special-shaped resin pad 3, and a second adhesive layer stacked in sequence. 6, the first chip 4, packaging material 1 is packaged on the circuit board 2 with the first adhesive layer 7, the special-shaped resin gasket 3, the second adhesive layer 6, and the first chip 4, and the first chip 4 is soldered The line 9 is electrically connected to the circuit board 2;

[0040] The special-shaped resin spacer 3 has two cavities divided by a partition, the cavities are open at the top, and a second chip 5 is arranged in each cavity, and the second chip 5 is bonded with a wire by welding. The circuit board 2 is electrically connected.

[0041] Preferably, the shaped resin gasket 3 is based on fiberglass cloth, and the weight ratio of the fiberglass cloth is 10-60wt%, and the following components are att...

Embodiment 2

[0061] This embodiment provides a stacked chip packaging structure based on special-shaped resin pads, as shown in Figure 2, including a circuit board 2, a first adhesive layer 7, a special-shaped resin pad 3, and a second adhesive layer stacked in sequence. 6, the first chip 4, packaging material 1 is packaged on the circuit board 2 with the first adhesive layer 7, the special-shaped resin gasket 3, the second adhesive layer 6, and the first chip 4, and the first chip 4 is soldered The line 9 is electrically connected to the circuit board 2;

[0062] The special-shaped resin spacer 3 has two cavities divided by a partition, the cavities are opened at the bottom, and a second chip 5 is arranged in each cavity, and the second chip 5 is connected to the The circuit board 2 is electrically connected.

[0063] The special-shaped resin gasket 3 is based on fiberglass cloth, and the weight ratio of the fiberglass cloth is 10-60wt%, and the following components are attached to it, i...

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PUM

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Abstract

The invention relates to a stacked chip packaging structure based on a special-shaped resin gasket, comprises a circuit board, a first adhesive layer, a profiled resin gasket, a second adhesive layer,a first chip and an encapsulating material, wherein the first adhesive layer, the profiled resin gasket and the second adhesive layer are encapsulated on the circuit board with the encapsulating material, and the first chip is electrically connected with the circuit board through bonding wires; At least one cavity is arranged in that middle of the shaped resin pad, and at least one second chip isarranged in the cavity, and the second chip is electrically connected with the circuit board through bonding wires. The stacked chip packaging structure of the invention can reduce the size of the chip packaging structure, save the packaging material, and improve the density of the chip in the unit area.

Description

technical field [0001] The invention relates to a stacked chip packaging structure based on special-shaped resin pads, and belongs to the technical field of chip packaging. Background technique [0002] With the development of modern integrated circuits, chip packaging technology in the microelectronics industry has developed rapidly from two-dimensional to three-dimensional stacked packaging to adapt to lighter, thinner, smaller, high-performance, low-power, and low-cost chip packaging structures. Market requirements. The three-dimensional stacked packaging technology not only increases the packaging density, reduces the cost, speeds up the packaging speed, but also greatly enhances the multi-functional integration without increasing the packaging size. [0003] At present, the gaskets used in the three-dimensional stacked chip packaging structure are silicon-based wafer gaskets. The disadvantage of this type of gasket is that the processing technology includes filming, th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/07H01L23/31
CPCH01L25/072H01L23/3121H01L2224/48091H01L2224/73265H01L2224/83385H01L2924/00014
Inventor 杨国宏
Owner SU ZHOU DREAM TECH CO LTD
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