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High-efficiency heat-dissipating backboard for new energy vehicle and manufacturing method thereof

A new energy vehicle, heat dissipation backplane technology, applied in the direction of circuit heating devices, printed circuit manufacturing, circuit substrate materials, etc., can solve the difficulty in meeting the lithium battery heat dissipation requirements of new energy vehicles, complex aluminum foil manufacturing process, harsh working environment, etc. problem, to achieve the effect of improving heat dissipation, high connection stability, and stable structure

Pending Publication Date: 2018-12-07
GUANGDONG CHENGDE ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the manufacturing process of the aluminum foil of the automobile heat dissipation backplane is complex, the cost is high, and the working environment is relatively harsh, requiring it to have good corrosion resistance and compressive strength, and its use is limited.
However, in recent years, in order to meet the requirements of lightweight vehicles, miniaturized components, and reduce material costs, the thickness of the material aluminum foil has been reduced, but it is difficult to meet the heat dissipation requirements of lithium batteries for new energy vehicles.

Method used

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  • High-efficiency heat-dissipating backboard for new energy vehicle and manufacturing method thereof
  • High-efficiency heat-dissipating backboard for new energy vehicle and manufacturing method thereof
  • High-efficiency heat-dissipating backboard for new energy vehicle and manufacturing method thereof

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Embodiment Construction

[0033] The present invention will be further described below in conjunction with the drawings.

[0034] According to the attached Figure 1 to Figure 2 As shown, the high-efficiency heat dissipation backplane of a new energy vehicle of the present invention includes a first circuit board 1, an epoxy resin board combination layer 2, a copper block 3, and a second circuit board 4. At least one installation slot 5 for assembling the copper block 3 is provided in the epoxy resin board combination layer 2. A non-flow adhesive base layer 6 is provided between the connection of the first circuit board 1 and the epoxy resin board combination layer 2, and a non-flow adhesive middle layer is provided between the connection of the epoxy resin board combination layer 2 and the second circuit board 4 7. The non-flow adhesive middle layer 7 is provided with an escape groove 16 corresponding to the installation groove 5. A copper foil layer 9 is provided on the upper surface of the second circu...

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Abstract

The invention provides a high-efficiency heat-dissipating backboard for a new energy vehicle and a manufacturing method thereof. The high-efficiency heat-dissipating backboard comprises a first circuit board, an epoxy resin board combination layer, copper blocks and a second circuit board. At least one mounting slots for assembling the copper block is formed in the epoxy resin board combination layer; and straight slots for cooling of the copper blocks are formed in the second circuit board and a flow-glue-free surface layer. The high-efficiency heat-dissipating backboard having a stable structure is installed conveniently; the compressive strength is enhanced; and the heat dissipation effect is improved. Meanwhile, since the first circuit board, a non-flow-glue base layer, the epoxy resinboard combination layer, a non-flow-glue intermediate layer, the second circuit board, the low-glue-free surface layer, and a copper foil layer are sequentially laminated and are fixedly connected toeach other by hot pressing, the manufacturing method is simplified, the connection stability is improved, and the usage quality of the electrical accessories is ensured.

Description

Technical field [0001] The invention relates to the technical field of heat dissipation backplanes, in particular to a high-efficiency heat dissipation backplane for new energy vehicles and a manufacturing method thereof. Background technique [0002] As the main core part of the car radiator, the heat dissipation backplane is used in automotive daytime running lights, car audio, car navigation and other electrical accessories. Especially the lithium batteries of new energy vehicles have higher requirements for the heat dissipation effect of the heat dissipation backplane. [0003] Traditional heat dissipation backplanes generally use composite brazing aluminum foil. That is, the bottom surface and the upper surface of the first circuit board modified from the composite material are respectively covered with aluminum-silicon type brazing material. However, the manufacturing process of the aluminum foil of the automobile heat dissipation backplane is complicated, the cost is high, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/03H05K3/46
CPCH05K1/0204H05K1/0353H05K3/4611H05K3/4697H05K2201/10416
Inventor 刘镇权吴子坚邬通芳梁访佳李文淳
Owner GUANGDONG CHENGDE ELECTRONICS TECH CO LTD
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