Printed-circuit board preparation method capable of avoiding galvanic effect

Abstract

The invention discloses a printed-circuit board preparation method capable of avoiding a galvanic effect. The printed-circuit board preparation method comprises the following steps that a base plate is prepared, and specifically, the base plate is provided with a copper layer and a metal layer electrically connected with the copper layer; a film is pasted, and specifically, protective film is covered on the metal layer; exposure is carried out, and specifically, the base plate pasted with the protective film is exposed; development is carried out, specifically, development treatment is carriedout on the base plate after the completion of exposure, the protective film of unexposed areas is cleaned and removed, the copper layer is exposed, and the remaining protective film fully covers themetal layer; micro erosion or roughening treatment is carried out, and specifically, the micro erosion or roughening treatment is carried out on the base plate; and the film is removed, specifically,after the micro erosion or roughening treatment is finished, and the protective film on the metal layer is removed through the film stripping process to obtain a printed-circuit board. According to the printed-circuit board preparation method, the metal layer on the copper layer is sealed and covered through increasing dry film or wet film, and the effect of the galvanic effect in the preparationprocess is avoided.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board preparation, and in particular relates to a method for preparing a printed circuit board which avoids the Giavani effect. Background technique [0002] Some special printed boards and carrier boards will choose two or more surface treatment methods during the preparation process. After one surface treatment, part of the surface of the product is covered with a metal layer that is different from the potential of the copper layer. The potential potential of the copper layer is different from that of the copper layer. When the metal layer and the adjacent copper layer are subjected to micro-etching or roughening treatment, they will be oxidized and eroded very quickly due to the formation of a chemical battery due to the Giavani effect, eventually resulting in the copper layer being too thin. Even line breaks, such as figure 1 shown. [0003] In response to this problem, the tradition...

AI Technical Summary

Problems solved by technology

But, firstly, in some circuit boards where the area to be protected is relatively complicated and strange, the tape sticking operation is cumbersome and the precision is too low, and the effect of the final product is poor; secondly, in the circuit boards where the lines are dense and the copper layer is very thick , the fluidity of the adhesive on the tape is not enough to completely fill the gap between adjacent lines, resulting in the exposure of some areas of the metal layer, and the Giavanni effect will still exist

Images