Optical waveguide laminated body and manufacturing method therefor

Abstract

This optical waveguide laminated body has an organic base layer X comprising an insulating layer 1 and a coverlay 3 laminated onto one surface of an optical waveguide W, and has a portion of the organic base layer X removed such that the optical waveguide W is partially exposed through the removed portion. Provided that P represents a transmittance of laser light in a prescribed wavelength range through the optical waveguide W at the exposed optical wave guide part and Q represents a transmittance of the laser light through at least a portion of the organic base layer X facing the exposed optical waveguide part, the P and Q satisfy the following relationships: P >= 70% and P-Q >= 25%. According to the optical waveguide laminated body, the organic base layer laminated onto the optical waveguide is removed with precision without incurring physical and thermal damage due to laser beam machining. As such, the optical waveguide laminated body maintains high quality.

Description

technical field [0001] The present invention relates to an optical waveguide laminate obtained by laminating an organic substrate layer such as an insulating film on at least one surface of an optical waveguide, and a method for producing the same. Background technique [0002] Along with the increase in the amount of information to be transmitted, in recent electronic devices and the like, optical wiring is used in addition to electrical wiring, and an opto-electrical hybrid substrate capable of simultaneously transmitting electrical and optical signals is often used. As such a photoelectric hybrid substrate, for example, the following structures are known: Figure 10 As shown, an insulating layer 1 formed of polyimide or the like is used as a substrate, an electrical wiring 2 formed of a conductive pattern is provided on the surface of the insulating layer 1 to form a circuit substrate E, and a light source is provided on the back side of the insulating layer 1. A waveguid...

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Problems solved by technology

[0010] In addition, in the case where the photoelectric hybrid board 10 is used as a connector for connection, as in Figure 11 As shown in (a), it is necessary to insert and fix the top portion of the opto-electric hybrid board 10 into the concave portion 11a of the sleeve (Japanese: ferrule) 11, but in order to prevent damage to the protruding portion of the circuit board E However, when the opening of the above-mentioned recessed portion 11a is designed so as to have a large gap with respect to the outer shape of the circuit board E, there arises a problem that the positioning of the core 7 in the recessed portion 11a cannot be performed correctly, and the connection based on the connector cannot be properly performed. optical coupling

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