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MEMS gas sensor chip and sensor and preparation method of sensor

A gas sensor, gas-sensitive technology, applied in thermometers, instruments, temperature control and other directions using electrical/magnetic components directly sensitive to heat, can solve the problems of high price, long response time, poor environmental stability, etc., to achieve the response time Short, less impact, good stability

Active Publication Date: 2018-11-20
BEIJING MECHANICAL EQUIP INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above analysis, the embodiment of the present invention aims to provide a MEMS gas sensor chip, sensor and sensor preparation method to solve the problems of high price, long response time and poor environmental stability in the prior art

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  • MEMS gas sensor chip and sensor and preparation method of sensor

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Embodiment 1

[0069] Such as figure 1 As shown, a specific embodiment of the present invention discloses a MEMS gas sensor chip, including a gas sensitive unit, a temperature sensitive unit, a sensitive structural substrate and a temperature control unit.

[0070] The gas sensitive unit and the temperature sensitive unit are in the same layer, they are respectively arranged above the sensitive structural substrate, and the bottom surfaces of both are in direct contact with the upper surface of the sensitive structural substrate.

[0071] The temperature control unit is arranged under the sensitive structure substrate and includes two electrical interfaces. The temperature control unit is used to control the temperature of the sensitive structure substrate surface.

[0072] During implementation, one electrical interface of the temperature control unit is grounded, and the other is connected to the control signal. When the actual temperature collected by the temperature sensitive unit is h...

Embodiment 2

[0075] Such as figure 2 As shown, optimization is carried out on the basis of the foregoing embodiments, the MEMS gas sensor also includes colloidal silicone grease with better thermal conductivity, and the upper surface of the temperature control unit passes through the colloidal silicone grease with better thermal conductivity and the sensitive structural substrate. The bottom surface is connected, and the thickness of the colloidal silicone grease layer does not exceed 50 μm. Good thermal conductivity means that the thermal conductivity of thermal silicone grease reaches above 2.0W / (m*K), the working environment temperature ranges from -40°C to 200°C, and its thickness is generally 1-5mm, which can be controlled by the application process thickness. Existing heat-conducting silicone greases for cooling CPUs can generally meet the above requirements.

[0076] Preferably, there may be one or more gas sensitive units and temperature sensitive units above the sensitive struc...

Embodiment 3

[0091] Such as Figure 6 As shown, this embodiment provides a MEMS gas sensor, including a MEMS gas sensor chip and a control circuit. The control circuit includes a microcontroller, an N-type MOSFET, a P-type MOSFET, and a power supply.

[0092] The input terminal of the microcontroller receives two input signals, one is the measured temperature output by the temperature sensitive unit, and the other is the preset temperature, which is set by the user according to the working requirements of the sensor. The output terminals of the microcontroller are respectively connected with the gates of the N-type MOSFET and the P-type MOSFET.

[0093] The source of the N-type MOSFET is connected to the source of the P-type MOSFET; the drain of the N-type MOSFET is connected to the positive power supply, and the drain of the P-type MOSFET is connected to the negative power supply.

[0094] One electrical interface of the temperature control unit is respectively connected to the source o...

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Abstract

The invention relates to an MEMS gas sensor chip and sensor and a preparation method of the sensor, belongs to the technical field of gas detection, and solves the problems of high technical cost, long response time and low environment stability in the prior art. The MEMS gas sensor chip comprises a gas sensitive unit, a temperature sensitive unit, a sensitive structure substrate and a temperaturecontrol unit. The MEMS gas sensor comprises the MEMS gas sensor chip and a control circuit, and the control circuit further comprises a microcontroller, an N type MOSFET, a P type MOSFET and a positive-negative power supply. The microcontroller compares a practical temperature collected by the temperature sensitive unit with a preset temperature, outputs a control signal according to a comparisonresult, controls ON / OFF of the N type MOSFET and the P type MOSFET, and further controls the direction and magnitude of a current through the temperature control unit and changes the surface temperature of the sensitive structure substrate. The MEMS gas sensor is simple in operation and high in versatility, can measure the concentration of different gases simultaneously, saves the cost, and is short in response time and high in environment stability.

Description

technical field [0001] The invention relates to the technical field of gas detection, in particular to a MEMS gas sensor chip, a sensor and a method for preparing the sensor. Background technique [0002] As an important means of obtaining environmental parameters, gas detection has high application value in the fields of air pollutant prevention and control, industrial harmful gas monitoring, and the Internet of Things. At present, the detection of gas is mainly realized by gas sensors. Commonly used gas sensors can be divided into electrochemical type, metal oxide type, contact combustion type, semiconductor type and MEMS gas sensor according to the working principle and its own structure. [0003] MEMS gas sensors have received extensive attention in recent years due to their small size, low cost, and simple structure. However, the sensitive structure of the existing MEMS gas sensor is greatly affected by environmental stress, the performance is low, and the stability in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K7/18G01N27/333G05D23/22
CPCG01K7/18G01N27/333G05D23/22
Inventor 刘宇航刘立滨李平许诺
Owner BEIJING MECHANICAL EQUIP INST
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