Film forming method for reducing warpage of mother board

Abstract

The invention provides a film forming method for reducing warpage of a mother board. The film forming method for reducing the warpage of the mother board comprises the following steps that the motherboard is provided, wherein the mother board comprises a plurality of panel regions arranged in an array and spacer regions located among the adjacent panel regions; partition baffle walls are formed in the spacer regions; metal thin film deposits on the mother board and is naturally broken at the partition baffle walls during deposition, so that the metal thin film comprises a plurality of independent metal blocks corresponding to the panel regions respectively. The partition baffle walls are formed in the spacer regions at first before film forming, so that the metal thin film is partitionedinto the independent blocks by the partition baffle walls in the film forming process, thus, the stress of the metal thin film is released, the warpage of the mother board is reduced, and the fragmentation risk of the mother board in the displacement process is reduced.

Description

Technical field [0001] The invention relates to the field of display technology, in particular to a film forming method for reducing the warpage of a mother board. Background technique [0002] With the development of display technology, flat display devices such as Liquid Crystal Display (LCD) have been widely used in mobile phones, TVs, and individuals due to their advantages of high image quality, power saving, thin body and wide application range. Various consumer electronic products, such as digital assistants, digital cameras, notebook computers, and desktop computers, have become the mainstream of display devices. [0003] Most of the liquid crystal display devices currently on the market are backlit liquid crystal displays, which include a liquid crystal display panel and a backlight module. The working principle of the liquid crystal display panel is to place liquid crystal molecules between two parallel glass substrates. There are many small vertical and horizontal wires...

AI Technical Summary

Problems solved by technology

[0005] In the prior art, metal aluminum is generally used as the conductive metal material in the array substrate. With the development of display technology, people have higher and higher requirements for the size, resolution and screen refresh rate of the display panel. Metals with higher resistivity Aluminum is not enough to meet the technical needs in high-quality display panels, so a technical solution is proposed to use metal copper instead of metal aluminum as the conductive metal material of the array substrate, such as figure 1 However, when metal copper is used as the conductive metal material of the array substrate, during the manufacturing process, due to the large thickness of the copper film 200, after the entire surface is deposited on the mother glass 100, the stress generated cannot be released, which will lead to The glass mother board 100 is warped. During the subsequent shifting process, due to the warping of the glass mother board 100, the suction cup on the manipulator cannot completely absorb the glass mother board 100, and the risk of fragmentation is greatly increased.

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