semiconductor integrated circuit with hkmg
An integrated circuit and semiconductor technology, applied in the field of semiconductor integrated circuits, to achieve the effects of improving electrical performance, preventing offset and disturbance, and low cost
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[0051] Such as image 3 Shown is the structural diagram of the semiconductor integrated circuit with HKMG in the embodiment of the present invention; the semiconductor integrated circuit with HKMG in the embodiment of the present invention includes:
[0052] FDSOI substrate structure, the FDSOI substrate comprises a bottom semiconductor layer 1, a buried oxide layer 2 and a top semiconductor layer 3, the buried oxide layer 2 is formed on the surface of the bottom semiconductor layer 1, and the top semiconductor layer 3 is formed on The surface of the buried oxide layer 2 . In the embodiment of the present invention, the bottom semiconductor layer 1 is a bottom silicon layer, the material of the buried oxide layer 2 is silicon oxide, and the top semiconductor layer 3 is a top silicon layer.
[0053] For the FDSOI process, it has the following typical characteristics: the wafer used, that is, the bottom semiconductor layer 1, has a layer of buried oxide (buried oxide, BOX), whi...
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