Semiconductor integrated circuit with HKMG
A technology of integrated circuits and semiconductors, applied in the field of semiconductor integrated circuits, to achieve the effects of eliminating metal gate boundary effects, improving electrical performance and low cost
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[0051] Such as image 3 Shown is the structural diagram of the semiconductor integrated circuit with HKMG in the embodiment of the present invention; the semiconductor integrated circuit with HKMG in the embodiment of the present invention includes:
[0052] FDSOI substrate structure, the FDSOI substrate comprises a bottom semiconductor layer 1, a buried oxide layer 2 and a top semiconductor layer 3, the buried oxide layer 2 is formed on the surface of the bottom semiconductor layer 1, and the top semiconductor layer 3 is formed on The surface of the buried oxide layer 2 . In the embodiment of the present invention, the bottom semiconductor layer 1 is a bottom silicon layer, the material of the buried oxide layer 2 is silicon oxide, and the top semiconductor layer 3 is a top silicon layer.
[0053] For the FDSOI process, it has the following typical characteristics: the wafer used, that is, the bottom semiconductor layer 1, has a layer of buried oxide (buried oxide, BOX), whi...
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