Gas control system of reflow oven and method of the same

Abstract

The invention discloses a gas control system of a reflow oven and a method of the same. The system comprises a reflow oven body, the right side of the reflow oven body is fixedly connected with a machine box, and the bottom of the right side of the machine box is fixedly connected with a tray; and the bottom of the back side of the reflow oven body communicates with an air suction box, a water tank is fixedly connected between the back face of the reflow oven body and the top of the air suction box; and the invention relates to the technical field of reflow ovens. According to the gas controlsystem of the reflow furnace and the method of the same, through the movement of a crankshaft, and two push rods can push a piston to move in turn through the cooperation of a fixing sleeve and a rotating rod, through the cooperation among four pipelines and four one-way valves, air in the reflow oven body can be replaced with helium gas before machining, so that oxygen can be prevented from affecting machining, air sucking and exhausting can be carried out at the same time, and the working efficiency is high; and the internal waste gas can be pumped out after the machining, use is convenientthrough a device to realized, moreover, the air sucking and the exhausting can be carried out synchronously, so that the gas exchange can be guaranteed thoroughly.

Description

technical field [0001] The invention relates to the technical field of reflow furnaces, in particular to a gas control system and method for reflow furnaces. Background technique [0002] The reflow oven, also known as the reflow oven (also called reflow soldering, reflow oven, reflow oven), is a kind of equipment required by the SMT process of the electronic technology industry. The reflow oven process is to achieve the soldering of the mechanical and electrical connections between the surface mount component terminals or pins and the printed board pads by remelting the paste solder that is pre-distributed on the printed board pads . The reflow furnace is the last key process of SMT. It is a real-time process control. Its process changes are complicated and involve many process parameters. Among them, the setting of the temperature curve is the most important, which directly determines the quality of reflow soldering. The temperature curve of the reflow oven is divided in...

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Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a reflow furnace gas control system and method, which solves the problem of completely replacing the internal oxygen with an inert gas at a specified time through the cooperation of the two devices, but if the cooperation of the two devices If it is not synchronized, it will affect the ventilation effect, which may cause the waste of inert gas or the problem of incomplete replacement

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