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Solder tip cleaning device and cleaning method

A technology for cleaning devices and soldering iron tips, which is applied to soldering irons, auxiliary devices, metal processing equipment, etc., can solve the problems that soldering iron tips are not easy to scrape tin, dirty and untidy, and inconvenient for welding operations, and achieves simple structure, improved cleanliness, The effect of reducing manpower

Inactive Publication Date: 2018-10-19
KUSN INFOVISION OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the current design, a wet sponge is placed on the soldering iron stand, and after scraping off the waste tin on the soldering iron tip, the soldering table becomes dirty and untidy due to waste tin contamination; and the tin-scraping sponge often slips to the The desktop is covered with waste tin, which makes it difficult for the soldering iron tip to scrape the tin; in addition, it is necessary to add water to the sponge from time to time, which brings great inconvenience to the current welding operation

Method used

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  • Solder tip cleaning device and cleaning method
  • Solder tip cleaning device and cleaning method
  • Solder tip cleaning device and cleaning method

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Embodiment Construction

[0028] Various embodiments of the invention will be described in more detail below with reference to the accompanying drawings. In the various drawings, the same elements are denoted by the same or similar reference numerals. For the sake of clarity, various parts in the drawings have not been drawn to scale.

[0029] It should be noted that in this document, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is a relationship between these entities or operations. There is no such actual relationship or order between them. Furthermore, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus comprising a set of elements includes not only those elements, but also includes elements not expressly listed. other elements of or also include ele...

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Abstract

The invention discloses a solder tip cleaning device and cleaning method. The cleaning device comprises a box, a cleaning device body, a waste material storage device, a water supply device and a control circuit, wherein the box is provided with a through hole; a solder tip extends into the box through the through hole; the cleaning device body is located in the box; the solder tip makes contact with the cleaning device body so as to enable waste materials on the solder tip to be removed when extending into the box; the waste material storage device is detachably mounted in the box and arranged below the cleaning device body; and the water supply device is mounted on the box, located above the cleaning device body and used for supplying water to the cleaning device body; the control circuit is connected with the cleaning device body and the water supply device and used for controlling the cleaning device body and the water supply device to operate. The solder tip cleaning device cleansthe solder tip through rotation of a rolling wheel; waste tin is collected through the box; a water box adds water to the rolling wheel automatically; the cleanliness of a working table is kept; andthe solder tip cleaning device is simple and practical.

Description

technical field [0001] The invention relates to the field of welding cleaning, in particular to a soldering iron tip cleaning device and cleaning method. Background technique [0002] In the prior art, workers often need to use a wet sponge to scrape off the waste tin on the tip of the soldering iron when welding, and then remelt new solder, which is beneficial to better welding work. In the current design, a wet sponge is placed on the soldering iron stand, and after the scrap tin on the tip of the soldering iron is scraped off, the soldering table becomes dirty and untidy due to the pollution of the scrap tin; and the tin-scraping sponge often slips to the The desktop is covered with waste tin, which makes it difficult for the soldering iron tip to scratch the tin; in addition, it is necessary to add water to the sponge from time to time, which brings great inconvenience to the current welding operation. [0003] In view of this, the applicant of the present invention aim...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/08
CPCB23K3/028B23K3/08
Inventor 白云春马录俊
Owner KUSN INFOVISION OPTOELECTRONICS
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