A Microchannel Radiator with Temperature Homogenization

Abstract

The invention discloses a temperature-uniform microchannel heat sink. The temperature-uniform microchannel heat sink comprises a substrate and a coolant distributor, coolant flow concentrators and partition plates which are arranged on the upper surface of the substrate and closely integrated into a whole with the substrate; 2<k> groups of heat dissipating channels are formed in the upper surfaceof the substrate, wherein k is an integer greater than or equal to 1, each group of heat dissipating channels is composed of multiple heat dissipating microchannels, and flow concentration grooves areformed at the two ends of each heat dissipating channel; a coolant inlet is formed in the top face of the coolant distributor, a liquid distribution channel is formed in the coolant distributor and composed of k layers of 2<k>-1 inverted T-shaped flow channels, inlets of the next layer of flow channels are connected with outlets of the previous layer of flow channels, and the outlets of the lastlayer of flow channels correspond to the heat dissipating channels one to one and are located in the middles of the heat dissipating channel groups respectively; and the structure of the coolant flowconcentrators is exactly the same as that of the coolant distributor. The temperature-uniform microchannel heat sink has the advantages of being higher in heat dissipating capacity, better in temperature uniformity and lower in pressure drop and has the excellent comprehensive heat dissipating performance.

Description

technical field [0001] The invention relates to a microchannel radiator, in particular to a microchannel radiator with uniform temperature, and belongs to the technical field of thermal management of electronic equipment. Background technique [0002] With the rapid development of integrated circuit technology and electronic packaging technology, electronic components show a trend of miniaturization and miniaturization, which makes the assembly density and power density of electronic components and equipment increase rapidly, the heat flux density increases sharply, and the thermal acceleration coefficient increases rapidly. rise. Studies have found that the failure rate of electronic components is exponentially related to temperature. Therefore, the problem of thermal design of electronic equipment has become increasingly prominent. In order to improve the adaptability and thermal reliability of electronic components and equipment to various harsh environmental conditions,...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the deficiencies of the prior art, the object of the present invention is to provide a microchannel heat sink with uniform temperature, which can effectively solve the problems of temperature uniformity of electronic equipment, large pressure drop inside the microchannel, uneven flow rate, etc.

Images