Silicon carbide ingot slicing device and silicon carbide ingot slicing method

Abstract

The invention discloses a silicon carbide ingot slicing device and a silicon carbide ingot slicing method. The silicon carbide ingot slicing device comprises a swinging wire cutting device and a worktable for fixing a silicon carbide ingot. The swinging wire cutting device includes a fixing base, a swinging table which is disposed on the fixing base and can swing relatively, a plurality of rollers, and a cutting line which is movably wound around the plurality of rollers at a linear velocity of at least 1510 m / min. The plurality of rollers collectively define a slicing channel through which the silicon carbide ingot passes. The portions of the cutting line on the slicing channel are arranged in parallel at intervals and are defined as a plurality of operation line segments. During the process that the silicon carbide ingot is cut by the plurality of operation line segments, the swinging table swings relative to the fixing base, and the worktable can be moved at an adjusted feed speed.The adjusted feed speed gradually decreases from an initial speed to the lowest speed and then gradually increases to the final speed, so that the cutting line is not liable to break and effectively improve the slicing quality of the silicon carbide ingot.

Description

technical field [0001] The invention relates to a slicing device and a slicing method, in particular to a silicon carbide ingot slicing device and a silicon carbide ingot slicing method. Background technique [0002] At present, the slicing equipment for cutting ingots can be divided into two fields according to different working principles for people in the industry: one is free mortar slicing, and the other is fixed wire slicing. The following roughly discusses the respective cutting working principles of the above two fields. [0003] First, if figure 1 As shown, in the field of free mortar slicing, the cost of the slicing equipment is relatively low, but when cutting the ingot 1a, the slicing equipment drives the silicon carbide particles 31a in the cutting fluid 3a to roll through the wire 2a, and then continuously Cutting the crystal ingot 1a in this way is easy to cause uneven thickness of the wafer. What's more, debris is likely to be generated at the cut part of ...

AI Technical Summary

Problems solved by technology

[0004] However, in the field of fixed wire slicing, most of the existing slicing equipment and operations for silicon carbide ingots use a line speed of 400 m / min to 700 m / min, which leads to poor slicing quality of silicon carbide ingots

However, if the line speed of existing slicing equipment and operations is increased, it will easily lead to problems such as cutting line breakage

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