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Two-component high-thermal-conductivity pouring sealant and preparation method thereof

A high thermal conductivity, potting adhesive technology, applied in adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve problems such as poor fluidity, achieve low density, good heat dissipation, and controllable curing time.

Inactive Publication Date: 2018-10-02
SHENZHEN MPD HITECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The thermal conductivity of potting adhesive prepared by some domestic silicon micropowder as filler is only 0.5-0.6W / mk, and the fluidity is extremely poor. There is no good way to solve the heat dissipation of high-power power supply.

Method used

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  • Two-component high-thermal-conductivity pouring sealant and preparation method thereof
  • Two-component high-thermal-conductivity pouring sealant and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A preparation method of a two-component high thermal conductivity potting glue, comprising the steps of:

[0028] (1) Preparation of component A: Add 145g of vinyl silicone oil, 105g of hydrogen-containing silicone oil, 37.5g of dimethyl silicone oil, 0.3g of polyvinyl ring (R-9) and 3g of fumed silica into the stirring tank, Stir at a stirring speed of 250rpm for 3 minutes until the fumed silica is completely submerged, then add 57.5g of aluminum hydroxide and 287.5g of γ-glycidyl etheroxypropyltrimethoxysilane modified silicon micropowder, stir at a stirring speed of 2500rpm for 80min, and vacuumize for 20min Debubble to obtain component A;

[0029] (2) Preparation of component B: Add 250g of vinyl silicone oil, 37.5g of dimethyl silicone oil, 3g of fumed silica and 1.3g of Castel platinum catalyst (Pt3000ppm) into the stirring tank in sequence, stirring at 250rpm for 3min to Fumed silica is completely submerged, then add 57.5g of aluminum hydroxide, 287.5g of γ-glyc...

Embodiment 2

[0032] A preparation method of a two-component high thermal conductivity potting glue, comprising the steps of:

[0033] (1) Preparation of component A: Add 145g of vinyl silicone oil, 105g of hydrogen-containing silicone oil, 37.5g of dimethyl silicone oil, 0.3g of polyvinyl ring body and 3g of fumed silica into the stirring tank in sequence, stirring at a stirring speed of 250rpm 3min until fumed silica is completely submerged, then add 43.3g of aluminum hydroxide and 388g of γ-methacryloxypropyltrimethoxysilane modified silicon micropowder, stir at 2500rpm for 80min, vacuumize for 20min to remove bubbles to obtain A component;

[0034] (2) Preparation of component B: Add 250g of vinyl silicone oil, 37.5g of dimethyl silicone oil, 3g of fumed silica and 1.3g of Castel platinum catalyst (Pt3000ppm) into the stirring tank in sequence, stirring at 250rpm for 3min to Fumed silica is completely submerged, then add 43.3g of aluminum hydroxide, 388g of γ-methacryloxypropyltrimetho...

Embodiment 3

[0038] A preparation method of a two-component high thermal conductivity potting glue, comprising the steps of:

[0039] (1) Preparation of component A: Add 145g of vinyl silicone oil, 105g of hydrogen-containing silicone oil, 37.5g of dimethyl silicone oil, 0.3g of polyvinyl ring body and 3g of fumed silica into the stirring tank in sequence, stirring at a stirring speed of 250rpm 3min until the fumed silica is completely submerged, then add 37.5g of aluminum hydroxide and 480g of γ-mercaptopropyltrimethoxysilane modified silicon micropowder, stir at 2500rpm for 80min, vacuumize for 20min to remove bubbles to obtain component A;

[0040] (2) Preparation of component B: Add 250g of vinyl silicone oil, 37.5g of dimethyl silicone oil, 3g of fumed silica and 1.3g of Castel platinum catalyst (Pt3000ppm) into the stirring tank in sequence, stirring at 250rpm for 3min to Fumed silica is completely submerged, then add 37.5g of aluminum hydroxide, 480g of γ-methacryloxypropyltrimethox...

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Abstract

The invention provides a two-component high-thermal-conductivity pouring sealant and a preparation method thereof. The two-component high-thermal-conductivity pouring sealant is composed of a component A and a component B in a mass ratio of 1: 1. The component A comprises, by mass, 6 to 20 parts of vinyl silicone oil, 3 to 14 parts of hydrogen-containing silicone oil, 2 to 6 parts of dimethyl silicone oil, 0.01 to 0.04 part of an inhibitor, 0.2 to 1 part of an anti-settling agent, 3 to 25 parts of a flame retardant and 25 to 70 parts of modified silica micropowder. The component B comprises, by mass, 9 to 34 parts of vinyl silicone oil, 3 to 14 parts of dimethyl silicone oil, 0.1 to 0.5 part of a catalyst, 0.1 to 1.0 part of an anti-settling agent, 3 to 25 parts of a flame retardant and 25to 70 parts of modified silicon micropowder. According to the invention, a silane coupling agent is utilized for modifying the surface of the silicon micropowder so as to improve the compatibility between the silicon micropowder and the silicone oil and increase the filling fraction of the silicon micropowder; and at the same time, through the synergistic action of the flame retardant, the thermal conductivity of the modified silicon micropowder can be greatly performed, and the flame retardant performance of the prepared pouring sealant is improved, so the high-thermal-conductivity pouring sealant is prepared.

Description

Technical field: [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a two-component high thermal conductivity potting glue and a preparation method thereof. Background technique: [0002] In recent years, safety accidents caused by power battery heating have occurred frequently, and how to solve battery safety problems has attracted more and more attention from the society. High thermal conductivity silicone potting compound has good heat dissipation, high flame retardant grade, strong weather resistance, and high Low temperature, shock resistance, and the performance of not causing the entire power supply to explode and burn in the event of a fire have been loved by the majority of the power supply industry. At present, alumina, silicon micropowder, silicon carbide, aluminum nitride, boron nitride and other powders are mainly used as filling materials for the preparation of high thermal conductivity potting adhesives, whil...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J183/05C09J183/04C09J11/04
CPCC08K2003/2224C08K2003/2227C08K2003/387C08L2201/02C08L2203/20C08L2205/025C08L2205/035C09J11/04C09J183/04C08L83/04C08K13/06C08K9/06C08K3/36C08K3/22C08K3/38
Inventor 李祖君杨绿娟
Owner SHENZHEN MPD HITECH CO LTD
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