Ceramic substrate material with high strength and high thermal expansion and preparation method of ceramic substrate material

Abstract

The invention belongs to the field of electronic ceramic packaging materials, particularly relates to a ceramic substrate material with high strength and high thermal expansion and a preparation method of the ceramic substrate material, and is suitable for ceramic packaging of large-scale integrated circuit chips, in particular for CBGA (ceramic ball grid array) packaging. A low-temperature co-firing process is adopted and is simple and easy to implement, raw materials are green and environmentally friendly and do not contain pollutants defined in RoHS (Restriction of the use of certain Hazardous Substances), and material performance is stable. By redesign of the material formula, the ceramic substrate material with high strength and high coefficient of thermal expansion has excellent dielectric properties: the dielectric constant is 5-6, and the dielectric loss is less than 1.0*10<-3>, bending strength is 170-190 MPa, Young's modulus is as high as 60-70 GPa and the coefficient of thermal expansion is (10-11)*10<-6> / DEG C; perfect thermal matching with a PCB with a specific thermal expansion coefficient can be realized, and an excellent ceramic substrate material is provided for ICdevice packaging; besides, the substrate material has low production cost and has industrial promotion benefits.

Description

technical field [0001] The invention belongs to the field of electronic ceramic packaging materials, relates to a high-strength and high-thermal-expansion ceramic substrate material and a preparation method thereof, and is suitable for ceramic packaging of large-scale integrated circuit chips, especially for ceramic ball grid array (CBGA) packaging. Background technique [0002] The rapid development of modern electronic information technology has greatly promoted the development of electronic devices in terms of high performance, high reliability, low cost, miniaturization, portability and popularization. The development of IC (Integrated Circuit) has greatly increased the density of circuits, and the functional density of circuits carried by an IC chip is several orders of magnitude larger than that of traditional printed circuits, especially VLSI (Very Large Scale Integration). The advantages of IC can only be optimized when it is integrated with other resistors, capacito...

AI Technical Summary

Problems solved by technology

However, there are still a series of problems in today's commonly used ceramic packaging materials: poor thermal matching performance between materials, electrode materials and chips, poor serialization of thermal expansion coefficient of substrate materials, and pollution of raw materials to the environment, etc.

The thermal expansion coefficient span range of the above materials is too large, and it will not be able to be thermally matched with the new PCB board with a thermal expansion coefficient of 10-11ppm / ℃ in the future, which is difficult to meet the application under some environmental conditions; and the raw materials contain Cr elements, which will cause environmental damage. Pollution

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