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Lightweight high-strength inorganic shaving board and preparation method thereof

A particleboard and high-strength technology, which is applied in the field of light-weight and high-strength inorganic particleboard and its preparation, can solve the problems affecting the strength of the board, the viscosity of the inorganic adhesive is high, and the weight is large, so as to improve the uniformity of application, high mechanical strength of the board, and mechanical strength. The effect of increasing strength

Inactive Publication Date: 2018-10-02
CENTRAL SOUTH UNIVERSITY OF FORESTRY AND TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high viscosity of inorganic adhesives in the production of inorganic particleboard, it is difficult to control the uniformity of sizing, which will affect the strength of the board to a certain extent.
In addition, due to the density of inorganic particleboard (usually at 1.2g / cm 3 above) is large, resulting in a large weight, so it is difficult to popularize and apply in furniture production

Method used

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  • Lightweight high-strength inorganic shaving board and preparation method thereof
  • Lightweight high-strength inorganic shaving board and preparation method thereof
  • Lightweight high-strength inorganic shaving board and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0031] A light-weight high-strength inorganic particle board of the present invention is composed of wood shavings, inorganic adhesives and sponge particles; the weight ratio of the wood particles, inorganic adhesives and sponge particles is 50:100:1; the aperture of the sponge particles is 150 nm, a porosity of 92%, and a particle size of 1 mesh; the inorganic adhesive is magnesium oxychloride cement whose viscosity is adjusted to 200-300 centipoise.

[0032] The preparation method of described lightweight high-strength inorganic particle board, comprises the steps:

[0033] (1) Selecting a block sponge with a pore diameter of 150nm and a porosity of 92%, is pulverized into 1 purpose sponge particles by a pulverizer;

[0034] (2) The sponge particles are sent into the vacuum mixer, the inorganic adhesive is sprayed into the surface of the sponge particles in the vacuum mixer by the screw pump, and the mixer is started simultaneously to carry out a normal pressure mechanical s...

Embodiment 2

[0040]A light-weight high-strength inorganic particleboard of the present invention is composed of wheat straw shavings (non-wood shavings), inorganic adhesives and sponge particles; the weight ratio of the wheat straw particles, inorganic adhesives and sponge particles is 60:120:1.5; the The pore diameter of the sponge particles is 300nm, the porosity is 95%, and the particle size is 4 meshes; the inorganic adhesive is sulfoaluminate cement whose viscosity is adjusted to 200-300 centipoise.

[0041] The preparation method of described lightweight high-strength inorganic particle board, comprises the steps:

[0042] (1) choose the massive sponge that aperture is 300nm, porosity 95%, be pulverized into 4 purpose sponge particles by pulverizer;

[0043] (2) The sponge particles are sent into the vacuum mixer, the inorganic adhesive is sprayed into the surface of the sponge particles in the vacuum mixer by the screw pump, and the mixer is started simultaneously to carry out a nor...

Embodiment 3

[0049] A light-weight high-strength inorganic particle board of the present invention is composed of bamboo shavings (non-wood shavings), inorganic adhesives and sponge particles; the weight ratio of the bamboo particles, inorganic adhesives and sponge particles is 55:110:2; the The pore diameter of the sponge particles is 200nm, the porosity is 92%, and the particle size is 2 meshes; the inorganic adhesive is portland cement whose viscosity is adjusted to 200-300 centipoise.

[0050] The preparation method of described lightweight high-strength inorganic particle board, comprises the steps:

[0051] (1) choose the massive sponge that aperture is 200nm, porosity 92%, be pulverized into 2 purpose sponge particles by pulverizer;

[0052] (2) The sponge particles are sent into the vacuum mixer, the inorganic adhesive is sprayed into the surface of the sponge particles in the vacuum mixer by the screw pump, and the mixer is started simultaneously to carry out a normal pressure mec...

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Abstract

The invention discloses a lightweight high-strength inorganic shaving board. The lightweight high-strength inorganic shaving board is prepared by mixing at least wood or non-wood shavings, an inorganic adhesive and sponge particles in the weight ratio of (40 to 60) to (100 to 120) to (1 to 3). A preparation method of the lightweight high-strength inorganic shaving board approximately comprises thefollowing steps: spraying the inorganic adhesive in the surfaces of the sponge particles and mixing uniformly; adding the wood or non-wood shavings and mixing uniformly; paving a mixture into a plateblank, and performing hot pressing to obtain a semi-finished product; and drying, edging and performing sanding treatment to obtain the lightweight high-strength inorganic shaving board after the semi-finished product is stacked. According to the lightweight high-strength inorganic shaving board disclosed by the invention, the application uniformity of the inorganic adhesive is effectively improved, and the density of the inorganic shaving board is effectively reduced to 0.8 to 1.0 g / m<3>, so that the weight of the inorganic shaving board is reduced; and moreover, the lightweight high-strength inorganic shaving board does not release free formaldehyde, and is waterproof, fireproof, high in mechanical strength and suitable to be popularized and applied in furniture production.

Description

technical field [0001] The invention belongs to the field of furniture and decoration material manufacturing, and in particular relates to a light-weight and high-strength inorganic particle board and a preparation method thereof. Background technique [0002] Inorganic particle board is a kind of artificial board prepared by combining inorganic adhesive and wood or non-wood shavings through a certain molding process. Inorganic particle board has the advantages of no free formaldehyde release, good waterproof and fireproof performance, and can be widely used in building wall materials, indoor and outdoor decoration materials and other fields. However, due to the high viscosity of inorganic adhesives in the production of inorganic particleboard, it is difficult to control the uniformity of sizing, which will affect the strength of the board to a certain extent. In addition, due to the density of inorganic particleboard (usually at 1.2g / cm 3 (above) are large, resulting in a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B27N1/02B27N3/10B27N3/18
CPCB27N1/0209B27N3/10B27N3/18
Inventor 郑霞李新功李佩琦林云飞高歌贺正国
Owner CENTRAL SOUTH UNIVERSITY OF FORESTRY AND TECHNOLOGY
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