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A three-degree-of-freedom ultrasonic vibration-assisted machining precision positioning platform

A technology of ultrasonic vibration and precise positioning, which is applied in the direction of machines/supports, supporting machines, mechanical equipment, etc., can solve the problems of few ultrasonic vibration-assisted processing platforms, cannot meet processing requirements, and cannot realize three-dimensional processing, etc., and achieves compact structure, Effect of reducing assembly and preventing damage

Inactive Publication Date: 2020-03-06
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the development of science and technology, micro-nano technology has developed rapidly, and the demand for complex micro-nano structures with nanometer precision is becoming more and more extensive. In order to obtain higher processing speed and processing accuracy, ultrasonic vibration is applied to micro-nano processing In the process, there are currently few ultrasonic vibration-assisted processing platforms, especially ultrasonic vibration micro-motion platforms with three-degree-of-freedom motion performance
At present, most ultrasonic vibration-assisted processing platforms have a small stroke and cannot realize three-dimensional processing, which cannot meet the processing requirements

Method used

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  • A three-degree-of-freedom ultrasonic vibration-assisted machining precision positioning platform
  • A three-degree-of-freedom ultrasonic vibration-assisted machining precision positioning platform
  • A three-degree-of-freedom ultrasonic vibration-assisted machining precision positioning platform

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Embodiment Construction

[0018] In order to further understand the invention content, characteristics and effects of the present invention, the following examples are given, and detailed descriptions are as follows in conjunction with the accompanying drawings:

[0019] as attached Figure 1 to Figure 5 As shown, a three-degree-of-freedom ultrasonic vibration-assisted machining precision positioning platform is an axisymmetric structure of the X-axis and the Y-axis, including a large platform and a small platform 9 integrally formed by wire-cutting of plates, and the center of the large platform is connected in series with the small platform 9 , the bottom of the small platform 9 is connected in series with the bridge amplifying mechanism 5 .

[0020] Four symmetrical differential amplifying mechanisms 4 are symmetrically connected to the outer peripheral side of the bridge-type amplifying mechanism 5 along the X direction and the Y direction through four groups of parallel sheet-shaped flexible hinge...

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Abstract

The invention discloses a three-degree-of-freedom supersonic vibration auxiliary machining and precise positioning platform. An electrospark wire-electrode cutting technology is used for processing, and assembling on machinery is reduced; four symmetric flexible differential amplifying mechanisms are connected in parallel, therefore, high-precision translation of a moving platform in an XY plane is realized, and translation of series bridge type amplifying mechanisms in a Z direction is realized; a large platform is serially connected with a small platform, and in-plane ultrasonic vibration isprovided by a high-frequency piezoelectric ceramic piece; the precise positioning platform is compact in structure, and can have high inherent frequency; and by the symmetric flexible mechanisms, coupling errors caused by mechanism transmission can be eliminated; the differential amplifying mechanisms and the bridge type amplifying mechanisms have large displacement amplifying ratio, and thus, the moving platform has large travel when translating in the X direction, the Y direction and the Z direction; and by four parallel sheet flexible hinge mechanisms connected with the bridge type mechanisms, decoupling of the precise positioning platform to X-direction translation and Y-direction translation of the moving platform can be realized, and the moving precision of the moving platform is improved.

Description

technical field [0001] The invention relates to the field of micro-nano manufacturing, in particular to a three-degree-of-freedom ultrasonic vibration-assisted machining precision positioning platform. Background technique [0002] With the development of science and technology, micro-nano technology has developed rapidly, and the demand for complex micro-nano structures with nanometer precision is becoming more and more extensive. In order to obtain higher processing speed and processing accuracy, ultrasonic vibration is applied to micro-nano processing In the process, there are currently few ultrasonic vibration-assisted processing platforms, especially ultrasonic vibration micro-motion platforms with three-degree-of-freedom motion performance. At present, most ultrasonic vibration-assisted processing platforms have small strokes and cannot realize three-dimensional processing, which cannot meet the processing requirements. Contents of the invention [0003] The purpose...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F16M11/04
CPCF16M11/045F16M11/046F16M11/048
Inventor 马越田延岭王福军卢康康张大卫
Owner TIANJIN UNIV
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