A kind of method for preparing anti-oxidation uranium tantalum film on metal uranium surface
A metal uranium and uranium oxide technology, applied in the field of material surface treatment, can solve the problems of oxidative corrosion and failure of metal uranium materials, achieve the effects of excellent corrosion resistance, inhibit oxidation failure, and improve atmospheric storage life
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specific Embodiment approach 1
[0009] Specific implementation mode 1: This implementation mode is a method for preparing an oxidation-resistant uranium-tantalum film on the surface of metal uranium, which is specifically completed according to the following steps:
[0010] Using a uranium-tantalum alloy target as a target material, an oxidation-resistant uranium-tantalum film is prepared on the surface of a metal uranium film or a metal uranium block by DC magnetron sputtering; the tantalum content in the oxidation-resistant uranium-tantalum film is 3 at.% to 12 at.% .
specific Embodiment approach 2
[0011] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is: the uranium-tantalum alloy target is used as the target material, and the oxidation-resistant uranium-tantalum film is prepared on the surface of the metal uranium film by DC magnetron sputtering. Specifically, the preparation is as follows :
[0012] 1. Ultrasonic cleaning the monocrystalline silicon substrate in acetone, ethanol and deionized water for 5 minutes to 60 minutes respectively, and drying with high-pressure nitrogen to obtain a clean monocrystalline silicon substrate;
[0013] 2. Place the clean single crystal silicon substrate in the center of the sample stage, adjust the distance between the metal uranium target and the center of the sample stage to be 5cm to 20cm, and the normal line of the metal uranium target and the plane of the sample stage form an angle of 45°; adjust the uranium-tantalum alloy The distance between the target and the center of the sample sta...
specific Embodiment approach 3
[0022] Specific embodiment three: the differences between this embodiment and specific embodiment two are: the purity of the metal uranium target described in step two is 99.99%; the purity of the uranium-tantalum alloy target is ≥99%, and the tantalum in the uranium-tantalum alloy target The content is 3at.%~15at.%. Others are the same as in the second embodiment.
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