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Packaging structure and packaging method of OLED device

A technology of packaging structure and packaging method, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device manufacturing, etc., can solve the problems of reduced service life of devices, poor water and oxygen barrier ability, and reduced service life of devices, so as to improve service life , Improve the effect of water and oxygen barrier performance

Active Publication Date: 2018-09-14
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Application Information

AI Technical Summary

Problems solved by technology

However, organic materials in OLED devices are easily corroded by water and oxygen, resulting in reduced device life. Therefore, effective packaging and transformation of OLED devices has become a research hotspot in the field of OLED packaging.
[0003] Usually, thin-film packaging adopts the structure of multi-layer film stacking to improve the water-oxygen barrier ability, and there will be a thicker organic layer in the multi-layer film as a stress buffer and foreign matter coating layer, but the water-oxygen barrier capacity of the organic layer Compared with the inorganic layer, the protection of the organic layer has attracted more and more attention from researchers.
[0004] At present, organic materials in OLED devices are still a major problem that reduces the service life of devices. Under the premise that some organic materials cannot be replaced by inorganic materials, the protection of organic materials is particularly important.

Method used

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  • Packaging structure and packaging method of OLED device
  • Packaging structure and packaging method of OLED device
  • Packaging structure and packaging method of OLED device

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Embodiment Construction

[0028] The liquid crystal display assembly provided by the embodiment of the present invention has been introduced in detail above. The principles and implementation modes of the present invention are explained by using specific examples in this paper. The description of the above embodiments is only for helping to understand the present invention. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation and application scope. In summary, the content of this specification should not be construed as limiting the present invention. The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [top], [bottom], [front], [back], [left], [right], [inside], [outside], [side], etc., are only for reference The orientation of th...

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Abstract

The invention provides a packaging structure and a packaging method of an OLED device. An organic layer is arranged between a first organic reinforcing layer and a second organic reinforcing layer, sothat the water and oxygen barrier property of the OLED device is improved; both the first organic reinforcing layer and the second organic reinforcing layer contain organic fluoride. The organic fluoride is combined with silica through chemical bonds, so that the combining property of organic and inorganic interfaces is superior to simple physical stacking, and the service life of the OLED deviceis further prolonged.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a packaging structure and a packaging method of an OLED device. Background technique [0002] OLED (Organic Lighting Emitting Diode, Organic Light Emitting Diode) devices have received widespread attention due to their advantages such as self-illumination, rich colors, fast response speed, wide viewing angle, and light weight. However, organic materials in OLED devices are easily corroded by water and oxygen, resulting in reduced device life. Therefore, effective packaging and transformation of OLED devices has become a research hotspot in the field of OLED packaging. [0003] Usually, thin-film packaging adopts the structure of multi-layer film stacking to improve the water-oxygen barrier ability, and there will be a thicker organic layer in the multi-layer film as a stress buffer and foreign matter coating layer, but the water-oxygen barrier capacity of the organic layer Comp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/844H10K71/00
Inventor 张兴永
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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