Combined type radiating fin for large-power surface-mounted electronic device

Abstract

The invention belongs to the technical field of radiating fins for electronic devices, and relates to a combined type radiating fin for a large-power surface-mounted electronic device. The combined type radiating fin comprises a top radiating fin, a bottom radiating fin, a silica gel gasket, and a threaded ring, wherein the top radiating fin comprises a top radiating vertical plate, a top radiating bottom plate and four threaded connection rods which are arranged from top to bottom; the top radiating vertical plate is fixed on the upper side of the top radiating bottom plate and comprises a group of upper plate surfaces; the threaded connection rods are arranged at the four corners of the lower side of the top radiating bottom plate, the outer surface and the inner surface of each threadedconnection rod are arc-shaped, threads are formed on the outer surface of each threaded connection rod, and the outer surfaces of the four threaded connection rods are located on a same circle; and the bottom radiating fin, the silica gel gasket and the threaded ring are located below the top radiating fin, and are sequentially connected and fixed with the threaded connection rods. The combined type radiating fin provided by the invention has the advantages that the possibility of uneven application of thermally conductive silicone is reduced, so that the radiating capability of the radiatingfin is improved.

Description

technical field [0001] The invention belongs to the technical field of radiators for electronic devices, and in particular relates to a combined radiator for high-power surface-mounted electronic devices. Background technique [0002] With the refined development of electronic products, the integration of hardware circuits and chips is getting higher and higher, and the highly integrated functional circuits are gradually modularized, and the chip functions are complicated, which requires large power consumption, which leads to functional modules and highly integrated chips. heat dissipation problem. The emergence of the heat sink is to solve the heat dissipation problem of the device. Generally, the heat sink is made of aluminum alloy, brass, and iron with good thermal conductivity. It can transfer the heat of the chip to the heat sink through full contact with the chip, and the heat sink will The heat is dissipated into the air. [0003] In order to make the integrated mo...

AI Technical Summary

Problems solved by technology

This application adopts double heat sinks, and the double heat sinks are set with threaded rings for firm treatment. The force on the upper and lower heat sinks is uniform, which solves the problem of uneven local pressure on the heat sinks, reduces the uneven distribution of thermal conductive silicone grease, and improves heat dissipation. The thermal conductivity of the sheet

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