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Board card radiator heat transfer cement pressing device

A heat-conducting cement and heat sink technology, applied in the direction of presses, stamping machines, manufacturing tools, etc., can solve problems such as heat sink deflection, loud noise, heat sink, heat-conducting pad and heat-dissipating elements cannot be in close contact, etc., to ensure pressing Quality, simplified heat dissipation structure, and avoid board deformation

Active Publication Date: 2018-09-07
ZHEJIANG UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the heat sink can be fixed by spring pins to adjust the height of the heat sink by using the spring force, the heat sink will be deflected due to the different compression heights of the springs, which will cause the heat sink, heat conduction pad and heat dissipation elements to not be in close contact and affect heat dissipation. There is a fit gap between the heat dissipation hole, which makes this installation method not suitable for use in a vibration environment, and will generate a lot of noise

Method used

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  • Board card radiator heat transfer cement pressing device
  • Board card radiator heat transfer cement pressing device
  • Board card radiator heat transfer cement pressing device

Examples

Experimental program
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Embodiment Construction

[0019] Such as figure 1 with figure 2 As shown, a heat-conducting cement pressing tool for radiators includes a frame 1, on which a cement mold 2 is placed horizontally, and a radiator positioning structure for positioning the radiator 3 is provided on the upper plane of the cement mold , the frame 1 is provided with a briquetting block 4 for pressing the radiator 3 on the mastic mould, and a briquetting lifting drive device for driving the briquetting up and down above the mastic mold.

[0020] Such as image 3 As shown, the upper plane of the cement mold is provided with a cement cavity 21 for placing the cement. The size and height of the cement cavity corresponding to the electronic components on the board are designed to be pressed into the corresponding heat-conducting cement block. Therefore, the position, quantity, depth and area of ​​the cement cavity 21 can be adjusted as required to meet the requirements of the heat-conducting cement block. Depending on the thic...

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Abstract

The invention discloses a board card radiator heat transfer cement pressing device; one board card is provided with one radiator; a pressed heat transfer cement block can fill gaps between each electronic element and the radiator on the board card; the heat transfer cement pressing device comprises a frame; the frame is horizontally provided with a cement die; the top surface of the cement die isprovided with a cement cavity used for placing the cement and a radiator fixing structure used for fixing the radiator; the frame is provided with a press block arranged above the cement die and usedfor pressing the radiator on the cement die, and a press block lift driving device used for driving the press block to lift. The cement thickness and shape requirements can be satisfied, thus ensuringthe heat transfer cement pressing quality.

Description

[0001] The patent application of the present invention is a divisional application of the invention and creation name "a radiator heat-conducting glue pressing tool and board heat dissipation structure". The application date of the original application is August 26, 2016, and the application number is 2016107294931. technical field [0002] The invention relates to a heat dissipation technology of a board card, in particular to a heat dissipation structure of a board card and a pressing tool for heat conduction glue of a radiator. Background technique [0003] In the prior art, a heat conduction pad is installed between the board and the heat sink. The commonly used installation method of the heat conduction pad is to use an elastic heat conduction pad to be die-cut by the manufacturer, then place the heat conduction pad on the device that needs heat dissipation, and use screws or spring pins to install the heat conduction pad. Fix the heat sink on the circuit board to ensure...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20B30B1/26
CPCB30B1/26H05K7/2039
Inventor 刘丹丹陈森炎包骏
Owner ZHEJIANG UNIV
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