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High-temperature-resistant modified adhesive

An adhesive, high temperature resistant technology, applied in the direction of adhesives, non-polymer adhesive additives, adhesive types, etc. The effect of contact

Inactive Publication Date: 2018-08-31
闫洪銮 +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, due to the low elongation of epoxy resin, high brittleness, and fatigue resistance of adhesive parts, if no modification treatment is carried out, the adhesive generally cannot withstand high temperature and has brittle defects, so the application field is limited.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] A high-temperature-resistant modified adhesive, each component by weight, 100 parts of epoxy resin, 50 parts of maleimide resin, 20 parts of alkylene glycidyl ether, 0.8 parts of ethylenediamine, methyl tetrahydro 2 parts of phthalic anhydride, 1 part of diphenylthiourea.

Embodiment 2

[0015] A high temperature resistant modified adhesive, the components are calculated by weight parts, 100 parts of epoxy resin, 30 parts of maleimide resin, 25 parts of alkylene glycidyl ether, 0.5 parts of ethylenediamine, methyl tetrahydro 1 part of phthalic anhydride, 0.5 part of diphenylthiourea.

Embodiment 3

[0017] A high-temperature-resistant modified adhesive, each component by weight, 100 parts of epoxy resin, 60 parts of maleimide resin, 15 parts of alkylene glycidyl ether, 1 part of ethylenediamine, methyl tetrahydro 3 parts of phthalic anhydride, 1.5 parts of diphenylthiourea.

[0018] A preparation process of a high-temperature-resistant modified adhesive, comprising the following steps:

[0019] Step 1. Add epoxy resin, maleimide resin, and ethylenediamine to the reaction kettle, and stir for one hour at 120 °;

[0020] Step 2. Cool to below 90°, add alkylene glycidyl ether, and continue to stir for half an hour;

[0021] Step 3. Add methyl tetrahydrophthalic anhydride and diphenylthiourea, and mix well to obtain a high-temperature-resistant modified adhesive.

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PUM

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Abstract

The invention discloses a high-temperature-resistant modified adhesive. The adhesive comprises the following components in parts by weight: 100 parts of epoxy resin, 30-60 parts of maleimide resin, 15-25 parts of alkylidene glycidyl ether, 0.5-1 part of ethylenediamine, 1-3 parts of methyl tetrahydrophthalic anhydride, and 0.5-2 parts of thiocarbanilide. The high-temperature-resistant modified adhesive provided by the invention is an epoxy adhesive, but the high-temperature-resistant modified adhesive breaks through the disadvantage that an epoxy adhesive is not resistant to high temperature,and the high-temperature-resistant modified adhesive has excellent adhesion at the high temperature.

Description

technical field [0001] The invention relates to an adhesive, in particular to a high temperature resistant modified adhesive. Background technique [0002] Epoxy resin is an adhesive with many excellent properties. Its composition structure is relatively complex, including many hydroxyl groups, ether bonds and epoxy groups. It has high stability, good adhesion performance, good electrical insulation performance, blending The advantages of good performance. [0003] However, due to the low elongation of epoxy resin, high brittleness, and fatigue resistance of adhesive parts, if no modification treatment is carried out, the adhesive generally cannot withstand high temperature and has brittle defects, so the application field is limited. Contents of the invention [0004] (1) Technical problems to be solved [0005] In order to overcome the defects of the prior art, the invention provides a high temperature resistant modified adhesive. [0006] (2) Technical solution [0...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J135/00C09J11/06
CPCC08L2201/08C09J11/06C09J163/00C08L35/00
Inventor 闫洪銮杨淑珍李红芹吴巧真
Owner 闫洪銮
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