A surface coating device and method for thin wire devices

Abstract

The invention discloses a surface coating device and method for thin wire devices, and relates to the field of coating equipment. The device includes: a liquid immersion tank, a liquid immersion control system and a purge control system. The liquid immersion tank is filled with coating liquid. The liquid immersion control system is used to immerse thin wire-shaped devices in the coating liquid. The coating layer is formed on the surface of the thin wire-shaped device, and the purge control system is used to evenly purge the coating layer on the surface of the thin wire-shaped device. The surface coating device and method for thin wire-shaped devices provided by the present invention can avoid beading on the surface of thin wire-shaped devices, make the coating liquid uniformly cover the surface of thin wire-shaped devices, and ensure the uniformity and smoothness of the surface of the device. Thickness requirements, and not easy to damage thin wire devices, can improve the yield of products.

Description

technical field [0001] The invention relates to the field of coating equipment, in particular to a surface coating device and method for thin wire devices. Background technique [0002] After the processing of thin-wire devices such as resistance wires and thermistors is completed, according to product characteristics and usage conditions, the surface needs to be coated with moisture-proof, salt-spray and radiation-proof treatments. At present, the commonly used coating methods are: 1. Dip coating: immerse the workpiece directly in the coating solution and then take it out; 2. Spraying: spray the coating solution on the surface of the workpiece under a certain pressure; 3. Spin coating: put the coating solution After dripping onto the surface of the workpiece, the workpiece rotates in the rotating chamber to spread the coating liquid to coat the required coating liquid on the surface of the workpiece; 4. Brushing: Use a brush dipped in an appropriate amount of coating liquid...

AI Technical Summary

Problems solved by technology

[0003] However, the current thin wire device coating process has inevitable defects when dealing with coating agents with high viscosity or easy solidification

For example, by dipping or spraying, the surface of thin wire-shaped devices is very easy to beaded, and it is easy to form a thickness difference between the top and the bottom, and the coating agent is prone to hypertrophy accumulation at the bottom, which cannot guarantee the uniformity and thickness of the device surface. Requirements directly lead to unqualified products; using spin coating or brushing methods, for devices with thinner diameters, it is easy to break thin wire devices, and the yield is low

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