Surface coating apparatus and method for thread-shaped device

Abstract

The invention discloses a surface coating apparatus and method for a thread-shaped device, relating to the field of a coating device. The surface coating apparatus comprises an immersion trough body,an immersion control system and a purging control system, wherein the immersion trough body is filled with a coating solution, the immersion control system is used for immersing the thread-shaped device in the coating solution, a coating layer is formed on the surface of the thread-shaped device, and the purging control system is used for uniformly purging the coating layer on the surface of the thread-shaped device. By adopting the surface coating apparatus and method, the beading on the surface of the thread-shaped device can be avoided, so that the coating solution uniformly covers the surface of the thread-shaped device, so that the surface uniformity and thickness requirement of the device can be ensured, the thread-shaped device is unlikely to damage, and the yield of the product canbe increased.

Description

technical field [0001] The invention relates to the field of coating equipment, in particular to a surface coating device and method for thin wire devices. Background technique [0002] After the processing of thin-wire devices such as resistance wires and thermistors is completed, according to product characteristics and usage conditions, the surface needs to be coated with moisture-proof, salt-spray and radiation-proof treatments. At present, the commonly used coating methods are: 1. Dip coating: immerse the workpiece directly in the coating solution and then take it out; 2. Spraying: spray the coating solution on the surface of the workpiece under a certain pressure; 3. Spin coating: put the coating solution After dripping onto the surface of the workpiece, the workpiece rotates in the rotating chamber to spread the coating liquid to coat the required coating liquid on the surface of the workpiece; 4. Brushing: Use a brush dipped in an appropriate amount of coating liquid...

AI Technical Summary

Problems solved by technology

[0003] However, the current thin wire device coating process has inevitable defects when dealing with coating agents with high viscosity or easy solidification

For example, by dipping or spraying, the surface of thin wire-shaped devices is very easy to beaded, and it is easy to form a thickness difference between the top and the bottom, and the coating agent is prone to hypertrophy accumulation at the bottom, which cannot guarantee the uniformity and thickness of the device surface. Requirements directly lead to unqualified products; using spin coating or brushing methods, for devices with thinner diameters, it is easy to break thin wire devices, and the yield is low

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