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Room-temperature curing conductive adhesive

A room temperature curing, conductive adhesive technology, applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problems of long curing time, poor storage performance, harsh curing conditions of conductive adhesives, etc., to reduce curing time, high Conductivity and adhesion, volume resistivity and adhesion are not affected by the effect

Inactive Publication Date: 2018-08-17
TAIYUAN HYPERION NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The curing conditions of conductive adhesives are harsh, long curing time and poor storage performance are also problems of conductive adhesives

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A room temperature curing conductive adhesive, including a base resin, a curing agent, an accelerator, a conductive filler, a diluent, and an auxiliary agent. The raw materials and mass percentages are as follows:

[0023] Epoxy resin E51 10%

[0024] Flake silver powder 50%

[0025] Butyl formate 30%

[0026] Methyl cellulose 2%

[0027] Ketoimines 7.5%

[0028] 2-ethyl-4-methylimidazole 0.5%.

[0029] The preparation process and steps of conductive adhesive are as follows:

[0030] Dissolve the epoxy resin E51 and methyl cellulose of the specified quality in the above raw material formula in butyl formate, then add the specified quality of ketimine, 2-ethyl-4-methylimidazole, and flake silver powder, and mix well , That is, the room temperature curing conductive adhesive.

[0031] Performance test: The prepared conductive adhesive was scraped on a glass substrate to form a conductive film with a length of 8.5 cm and a width of 1 cm. The surface resistance measured with a multimet...

Embodiment 2

[0033] A room temperature curing conductive adhesive, including a base resin, a curing agent, an accelerator, a conductive filler, a diluent, and an auxiliary agent. The raw materials and mass percentages are as follows:

[0034] Epoxy resin E51 10%

[0035] Flake silver powder 60%

[0036] Butyl formate 20%

[0037] Methyl cellulose 2%

[0038] Ketoimine 7%

[0039] 2-Ethyl-4-methylimidazole 1%.

[0040] The preparation process and steps of conductive adhesive are as follows:

[0041] Dissolve the epoxy resin E51 and methyl cellulose of the specified quality in the above raw material formula in butyl formate, then add the specified quality of ketimine, 2-ethyl-4-methylimidazole, and flake silver powder, and mix well , That is, the room temperature curing conductive adhesive.

[0042] Performance test: The prepared conductive adhesive was scraped on a glass substrate to form a conductive film with a length of 8.5 cm and a width of 1 cm. The surface resistance measured with a multimeter is...

Embodiment 3

[0044] A room temperature curing conductive adhesive, including a base resin, a curing agent, an accelerator, a conductive filler, a diluent, and an auxiliary agent. The raw materials and mass percentages are as follows:

[0045] Epoxy resin E51 9%

[0046] Flake silver coated copper powder 55%

[0047] Butyl acetate 26%

[0048] Ethyl cellulose 2%

[0049] Ketoimine 7.5%

[0050] 2-Methylimidazole 0.5%.

[0051] The preparation process and steps of conductive adhesive are as follows:

[0052] Dissolve the epoxy resin E51 and ethyl cellulose of the specified quality in the above raw material formula in butyl acetate, then add the specified quality of ketimine, 2-methylimidazole, and flaky silver-coated copper powder, and mix them evenly. The room temperature curing conductive adhesive is obtained.

[0053] Performance test: The prepared conductive adhesive was scraped on a glass substrate to form a conductive film with a length of 8.5 cm and a width of 1 cm. The surface resistance measure...

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PUM

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Abstract

The invention discloses a room-temperature curing conductive adhesive which is prepared from, by weight, 5-30% of substrate resin, 40-70% of conductive fillers, 5-20% of curing agents, 1-7% of accelerators, 15-40% of diluting agents and 1-5% of additives. According to the indoor-temperature curing conductive adhesive, indoor-temperature curing can be achieved, indoor-temperature long-term storageis achieved, curing time is short, volume resistivity is low, adhesive force is high, and the conductive adhesive has good conductive performance. The conductive adhesive is stored at the indoor temperature for a long time, the volume resistivity and the adhesive force are not affected, and the conductive adhesive is high in stability, convenient to store and can be used for a long time.

Description

Technical field [0001] The invention belongs to the field of semiconductor materials, and specifically is a room temperature curing conductive adhesive. Background technique [0002] As a substitute for traditional packaging materials-solder in the field of electronic packaging, conductive adhesives have many advantages: environmentally friendly, non-toxic metals, no pre-cleaning and post-welding cleaning required in the process, mild curing temperature, greatly reducing thermal damage to electronic devices And internal stress, especially suitable for heat-sensitive materials and non-weldable materials. The many advantages of conductive adhesives adapt to the current development trend of miniaturization, lightness and integration of electronic devices, and are widely used in IC packaging, LED packaging, solar cells, radio frequency antennas and other microelectronic packaging fields. [0003] In the prior art, the silver content of conductive adhesive is relatively high, generally...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J163/00
CPCC09J9/02C08K2003/0806C08K2003/085C09J163/00C08L1/28C08K3/08C08K9/10
Inventor 赵栋奇黄翟郎嘉良
Owner TAIYUAN HYPERION NEW MATERIAL CO LTD
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