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Ceramic insulator for electronic packaging and manufacturing method thereof

A ceramic insulator, electronic packaging technology, applied in insulators, circuits, electrical components and other directions, can solve the problem of large size of ceramic metal packaging shell, achieve the effect of good thickness and uniformity, wide application range and simple production method

Pending Publication Date: 2018-08-14
HEBEI SINOPACK ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to provide a ceramic insulator for electronic packaging to solve the technical problem in the prior art that the metal parts can only be welded on the outside of the ceramic insulator and the size of the shell of the ceramic metal package is large.

Method used

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  • Ceramic insulator for electronic packaging and manufacturing method thereof
  • Ceramic insulator for electronic packaging and manufacturing method thereof
  • Ceramic insulator for electronic packaging and manufacturing method thereof

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Embodiment Construction

[0032] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0033] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0034] It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated orientations...

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Abstract

The invention provides a ceramic insulator for electronic packaging and a manufacturing method thereof. The ceramic insulator for electronic packaging comprises a ceramic insulator main body formed bypressing a plurality of ceramic wafers; the ceramic wafer is provided with a polygonal through hole, and hole wall of the through hole is coated with a metal layer. The manufacturing method comprisesthe following steps: punching a rectangular hole on the ceramic wafer, and performing hollow metallization for the rectangular hole; punching a polygonal hole on the ceramic wafer, wherein at least one hole wall of the polygonal hole is superposed with the hole wall of the rectangular hole; repeating the steps above, manufacturing a plurality of ceramic wafers with through holes; and pressing theplurality of ceramic wafers to form the ceramic insulator. According to the ceramic insulator for electronic packaging, a metal block can be welded at the inside of the ceramic insulator main body, thus, volume of a ceramic metal packaging housing is reduced. In the manufacturing method, a mode of combination of a hole punching technology and a hollow metallization technology, metallization coating of the inner wall of the ceramic insulator cavity is realized, thickness and uniformity of a metallization layer both are excellent, and metallization quality is high.

Description

technical field [0001] The invention belongs to the technical field of ceramic shell preparation, and more specifically relates to a ceramic insulator for electronic packaging and a method for manufacturing the ceramic insulator for electronic packaging. Background technique [0002] Ceramic insulators for electronic packaging are the most important part of ceramic metal packaging shells, and are widely used in the field of optoelectronic communications. Ceramic insulators for electronic packaging need to be metallized on some of their sides, that is, a layer of metal film that is firmly bonded to the ceramic and not easy to be melted is added on the side, so that the ceramic insulator and the metal parts can be connected with high-temperature solder here. welded together. [0003] The quality of the metallization of ceramic insulators depends on the quality of the ceramic itself and the metallization process. The main factors affecting the metallization quality in the met...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B17/38H01B17/50H01B19/00
CPCH01B17/38H01B17/50H01B19/00
Inventor 崔朝探刘林杰李志宏郝瑾张驰
Owner HEBEI SINOPACK ELECTRONICS TECH
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