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Method for improving electric conduction and heat conduction performance and mechanical property of polymers

A technology of electric conduction and heat conduction and polymer, which is applied in the direction of chemical instruments and methods, heat exchange materials, etc., can solve the problems of reducing the comprehensive performance of composite materials with mechanical properties, and achieve the effects of shortening the processing cycle, high electrical and thermal conduction, and low cost

Inactive Publication Date: 2018-08-14
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Conductive and thermally conductive polymer composite materials are widely used in production and living fields. To improve their electrical and thermal conductivity, fillers such as conductive carbon black and thermally conductive metals are usually added to them. However, adding a large amount of fillers will inevitably reduce its mechanical properties and its composite properties. Comprehensive properties of materials

Method used

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  • Method for improving electric conduction and heat conduction performance and mechanical property of polymers

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] (1) Dry the polypropylene in vacuum at 80°C for 12 hours;

[0016] (2) 90 parts by weight of dry-processed polypropylene and 10 parts by weight of low-melting metal Bi were put into an internal mixer for melt blending at 260° C., and the blending time was 5 minutes;

[0017] (3) After drying and granulating, carry out micro-injection molding processing, the injection speed is 300mm / s, the injection temperature is 260°C, the injection pressure is 1200bar, and the mold temperature is 80°C; the shape of the obtained spline is dumbbell-shaped, and the size is 15* 3*0.3mm 3 . The obtained splines were tested for mechanical properties and electrical and thermal properties, and the performance results are shown in Table 1.

[0018] Table 1 polypropylene and the mechanical properties and thermal conductivity of the thermally conductive polypropylene composite material obtained in Examples 1-5

[0019]

Embodiment 2

[0021] (1) Dry the polypropylene in vacuum at 80°C for 12 hours;

[0022] (2) 90 parts of dry-processed polypropylene and 10 parts by weight of low melting point metal Sn are put into an internal mixer and blended at 260° C., and the blending time is 5 minutes;

[0023] (3) After drying and granulating, carry out micro-injection molding processing, the injection speed is 300mm / s, the injection temperature is 260°C, the injection pressure is 1200bar, and the mold temperature is 100°C; the shape of the obtained spline is dumbbell-shaped, and the size is 15* 3*0.3mm 3 . The obtained splines were tested for mechanical properties and electrical and thermal properties, and the performance results are shown in Table 1.

Embodiment 3

[0025] (1) Dry the polypropylene in vacuum at 80°C for 12 hours;

[0026] (2) 90 parts by weight of dry-treated polypropylene and 10 parts by weight of low melting point metal Pb are put into an internal mixer and blended at 260° C., and the blending time is 5 minutes;

[0027] (3) After drying and granulating, carry out micro-injection molding processing, the injection speed is 300mm / s, the injection temperature is 260°C, the injection pressure is 1200bar, and the mold temperature is 110°C; the shape of the obtained spline is dumbbell-shaped, and the size is 15* 3*0.3mm 3 . The obtained splines were tested for mechanical properties and electrical and thermal properties, and the performance results are shown in Table 1.

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Abstract

The invention belongs to the field of a high molecular material, and particularly relates to a method for improving electric conduction and heat conduction performance and mechanical property of polymers. The invention provides the method for improving the electric conduction and heat conduction performance and mechanical property of polymers. The method comprises the following steps of adding low-melting-point alloy in polymers; performing melting blending in 260 DEG C to obtain a polymer / low-melting-point alloy mixture; then, performing micro injection shaping on the mixture so that the low-melting-point alloy forms micro fiber in the polymers, wherein the ratio of the polymers to the low-melting-point alloy is shown as follows: the polymers account for 100 weight parts, and the low-melting-point alloy accounts for 1 to 20 weight parts. The low-melting-point alloy is added into the polymers; through the micro injection forming method, the formation of the in-situ fiber with the goodform in the polymers by the low-melting-point alloy is realized; a network structure is formed, so that the enhancing effect is achieved; the use content of the metal materials can be obviously reduced; the higher conduction and heat conduction effects are achieved.

Description

technical field [0001] The invention belongs to the field of polymer materials, and in particular relates to a method for simultaneously improving the electrical and thermal conductivity and mechanical properties of polymers. Background technique [0002] Conductive and thermally conductive polymer composite materials are widely used in production and living fields. To improve their electrical and thermal conductivity, fillers such as conductive carbon black and thermally conductive metals are usually added to them. However, adding a large amount of fillers will inevitably reduce its mechanical properties and its composite properties. Comprehensive performance of materials. Contents of the invention [0003] In view of the above defects, the present invention provides a method for improving the electrical and thermal conductivity and mechanical properties of the polymer, and the obtained composite material has good electrical and thermal conductivity and mechanical propert...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/12C08L23/06C08K7/06C09K5/14
CPCC08K7/06C08K2201/001C09K5/14C08L23/12C08L23/06
Inventor 杨其赵中国
Owner SICHUAN UNIV
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