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Antenna packaging structure and packaging method

A technology of packaging structure and antenna structure, which is applied in the direction of antenna support/mounting device, radiation unit cover, etc., can solve the problems of low antenna efficiency and low integration of antenna packaging, etc., achieve high integration, improve efficiency and performance, and widely The effect of applying the foreground

Active Publication Date: 2022-03-01
SJ SEMICON JIANGYIN CORP
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0007] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide an antenna packaging structure and packaging method, which are used to solve the problems of low integration of antenna packaging and low antenna efficiency in the prior art.

Method used

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  • Antenna packaging structure and packaging method
  • Antenna packaging structure and packaging method

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Embodiment Construction

[0049] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0050] see Figure 1 to Figure 19 . It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of ​​the present invention, so that only the components related to the present invention are shown in the diagrams rather than the number, shape and Dimensional drawing, the type, quantity and proportion of each component can be changed arbitrarily during actual implementation, and the...

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Abstract

The present invention provides an antenna packaging structure and packaging method. The packaging structure includes an antenna circuit chip, a first rewiring layer, an antenna structure, a second metal connection post, a second packaging layer, a second antenna metal layer, and a second metal bump block, the antenna circuit chip, the antenna structure and the second antenna metal layer are interconnected through the rewiring layer and the metal connection post. The antenna packaging structure of the present invention adopts the method of multi-layer rewiring layer interconnection, which can realize the integration of multi-layer antenna metal layers, and can realize the direct vertical interconnection between multiple antenna packaging structures, thereby greatly improving the efficiency and efficiency of the antenna. performance, and the antenna packaging structure and method of the present invention have high integration; the present invention uses a fan-out packaging method to package the antenna structure, which can effectively reduce the packaging volume, so that the antenna packaging structure has a higher degree of integration and better packaging performance, and has broad application prospects in the field of semiconductor packaging.

Description

technical field [0001] The invention belongs to the field of semiconductor packaging, in particular to an antenna packaging structure and packaging method. Background technique [0002] Due to the progress of science and technology, various high-tech electronic products have been developed to facilitate people's life, including various electronic devices, such as notebook computers, mobile phones, tablet computers (PADs), and the like. [0003] With the popularization of these high-tech electronic products and the increase of people's demand, in addition to the substantial increase of various functions and applications configured in these high-tech products, especially in order to meet people's mobile needs, the function of wireless communication has been added. Therefore, people can use these high-tech electronic products at any place or at any time through these high-tech electronic devices with wireless communication functions. Thereby greatly increasing the flexibility ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/42H01Q1/12
CPCH01Q1/12H01Q1/42
Inventor 陈彦亨林正忠吴政达林章申
Owner SJ SEMICON JIANGYIN CORP
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