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Plating solution for carrier copper foil peeling layer and preparation method of peeling layer

A technology of carrier copper foil and peeling layer, which is applied in the field of preparation of plating solution and peeling layer, and achieves the effects of low cost, good conductivity and simple operation

Active Publication Date: 2019-12-24
胡旭日
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention aims at the shortcomings of the peeling layer in the production process of the existing ultra-thin electrolytic copper foil, and provides a plating solution for the peeling layer of the carrier copper foil and a preparation method for the peeling layer

Method used

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  • Plating solution for carrier copper foil peeling layer and preparation method of peeling layer

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] A kind of plating solution of carrier copper foil peeling layer, comprises following component: the content of potassium hydrogen tartrate is 40g / L, and the content of zinc sulfate is 12g / L, and the content of additive A is 12g / L, and additive A is 3-( Methacryloyloxy)propyltrimethoxysilane, potassium thiocyanate and potassium dihydrogen phosphate are mixed at a mass ratio of 1:5:5, pH=3.8-4.2.

[0019] The method for preparing the peeling layer of the carrier copper foil using the above-mentioned plating solution includes the following steps: controlling the temperature of the plating solution to be 35°C, and then putting the carrier copper foil into the plating solution, under the action of a direct current with a voltage of 20V and a current of 5A , electroplating a layer of new nano-composite zinc coating as the peeling layer, the electroplating time is 3s, and the peeling layer is obtained.

Embodiment 2

[0021] A kind of plating solution of carrier copper foil peeling layer, comprises following component: the content of potassium hydrogen tartrate is 60g / L, and the content of zinc sulfate is 16g / L, and the content of additive A is 20g / L, and additive A is 3-( 2,3-Glycidoxy)propyltrimethoxysilane, 3-(2,3-Glycidoxy)propyltriethoxysilane and sodium acetate are mixed at a mass ratio of 2:2:8 , pH=3.0~3.6.

[0022] The method for preparing the peeling layer of the carrier copper foil using the above-mentioned plating solution comprises the following steps: controlling the temperature of the plating solution to be 25°C, and then putting the carrier copper foil into the plating solution, under the action of a direct current with a voltage of 20V and a current of 5A , electroplating a layer of new nano-composite zinc coating as the peeling layer, the electroplating time is 3s, and the peeling layer is obtained.

Embodiment 3

[0024] A kind of plating solution of carrier copper foil peeling layer, comprises following component: the content of potassium hydrogen tartrate is 20g / L, and the content of zinc sulfate is 8g / L, and the content of additive A is 5g / L, and additive A is 3-( 2,3-Glycidoxy)propylmethoxydiethoxysilane, 3-(methacryloyloxy)propyltrimethoxysilane, sodium acetate, ammonium sulfate in a mass ratio of 1:1:3 : 5 mixed, pH=4.5~5.0.

[0025] The method for preparing the peeling layer of the carrier copper foil using the above-mentioned plating solution includes the following steps: controlling the temperature of the plating solution to be 45°C, and then putting the carrier copper foil into the plating solution, under the action of a direct current with a voltage of 20V and a current of 5A , electroplating a layer of new nano-composite zinc coating as the stripping layer, the electroplating time is 5s, and the stripping layer is obtained.

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Abstract

The invention relates to a plating solution for a carrier copper foil stripping layer and a preparation method of the stripping layer. The plating solution is prepared from components as follows: potassium bitartrate with the concentration of 20-60 g / L, zinc sulfate with the concentration of 8-16 g / L and an additive A with the concentration of 5-20 g / L and the pH of 3.0-5.0, wherein the additive Ais a mixture formed by mixing at least one of 3-(2,3-epoxy propoxy)propyl trimethoxy silane, 3-(2,3-epoxy propoxy)propyltriethoxysilane, 3-(2,3-epoxy propoxy)propyl methoxy dimethyldiethoxylsilane or3-(methylacryloyl oxy)propyl trimethoxy silane with at least one of potassium thiocyanate, monopotassium phosphate, sodium acetate or ammonium sulfate. The carrier copper foil stripping layer obtained with the adoption of the plating solution for the carrier copper foil stripping layer and the preparation method of the stripping layer is a novel nano composite zinc plating layer, is very thin anduniform and can completely and stably strip carrier foil off the pressed very thin copper foil.

Description

technical field [0001] The invention relates to a plating solution for a carrier copper foil peeling layer and a preparation method for the peeling layer, belonging to the technical field of electrolytic copper foil preparation. Background technique [0002] With the development of electronic products in the direction of light, thin, short, small, multi-functional and high added value, the development of high-density interconnect printed circuit board (HDI PCB) is promoted. About 90% of mobile phones on the market currently use HDI PCB is used as the bottom plate, and the main condition for making HDI PCB is to use extremely thin electrolytic copper foil. The thinner the copper foil, the more difficult it is to produce, and it can easily wrinkle and tear during shipping. Therefore, the production technology of ultra-thin copper foil will also become a research hotspot in the future. [0003] At present, the preparation method of ultra-thin copper foil is to use 18 or 35 mi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D1/22C25D1/04
CPCC25D1/04C25D1/22
Inventor 胡旭日
Owner 胡旭日
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