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Infrared laser

A laser and infrared technology, applied in the field of infrared lasers, can solve the problems of large volume and weight, high noise, complex structure, etc., achieve heat dissipation and temperature control, ensure miniaturization, and good cooling effect

Inactive Publication Date: 2018-07-24
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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Problems solved by technology

[0003] At present, the heat dissipation of lasers mainly adopts air cooling, water cooling, phase change refrigeration, compressor cooling, micro-channel heat sink cooling and other methods. Among them, high-power pump lasers mainly use water cooling or compressor cooling. The above two cooling methods have large volume and weight. , complex structure, high noise and other problems, which cannot meet the development needs of laser miniaturization and the temperature control effect is not ideal

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Embodiment Construction

[0028] The object of the present invention is to provide an infrared laser, the structural design of which can not only meet the requirement of miniaturization but also ensure better heat dissipation effect.

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] see Figure 1-Figure 3 , The infrared laser provided by the embodiment of the present invention includes a chassis 1, a pump module 2, a semiconductor cooling chip 3 and a heat dissipation device. Wherein, the pumping module 2 is located inside t...

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Abstract

The invention discloses an infrared laser, which comprises a case, a pump module arranged in the case, semiconductor refrigeration sheets arranged in the case and a heat dissipation device arranged outside the case, wherein a first side of each semiconductor refrigeration sheet is arranged close to the pump module, and a second side of each semiconductor refrigeration sheet is arranged close to the wall of the case; and the heat dissipation device is arranged opposite to the second side of each semiconductor refrigeration sheet. The semiconductor refrigeration sheets perform temperature control on the pump module, the semiconductor refrigeration sheets are small in occupied space, simple in structure and low in noise, and the miniaturization requirement of the laser can be ensured. In addition, the semiconductor refrigeration sheets are good in refrigeration effect, and can realize heat dissipation and temperature control for the pump module through adjusting the voltage and directionof the two ends of the semiconductor refrigeration sheets.

Description

technical field [0001] The present invention relates to the technical field of lasers, more specifically, to an infrared laser. Background technique [0002] When the mid-infrared all-solid-state laser is working, the pump module will generate a lot of waste heat, which needs to be dissipated in time, and keep the temperature of the pump module within a stable range, otherwise it will affect the output wavelength and output power of the pump module, and even damage the laser . Therefore, it is necessary to thermally control the internal pump module of the mid-infrared all-solid-state laser to ensure the normal and stable operation of the laser. [0003] At present, the heat dissipation of lasers mainly adopts air cooling, water cooling, phase change refrigeration, compressor cooling, micro-channel heat sink cooling and other methods. Among them, high-power pump lasers mainly use water cooling or compressor cooling. The above two cooling methods have large volume and weight....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S3/042H01S3/04
CPCH01S3/042H01S3/0405
Inventor 于德洋陈飞张阔何洋潘其坤
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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