A computer power supply cooling device

A computer power supply and heat dissipation device technology, which is applied in computing, electrical digital data processing, instruments, etc., can solve the problems that power supply heat dissipation devices cannot effectively achieve heat dissipation and cost consumption, so as to improve heat conduction efficiency, realize changes, and improve contact exchange. The effect of thermal efficiency

Active Publication Date: 2021-04-30
WENZHOU POLYTECHNIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the configuration of the computer is upgraded at the user end or the operating environment is relatively special (low temperature / high temperature), the power cooling device matched by the original factory cannot effectively dissipate heat. At this time, it is necessary to upgrade and replace the cooling device at the same time. Brings additional cost consumption

Method used

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  • A computer power supply cooling device
  • A computer power supply cooling device
  • A computer power supply cooling device

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Embodiment Construction

[0020] The standard parts used in the present invention can be purchased from the market, and the special-shaped parts can be customized according to the instructions and the accompanying drawings. The specific connection methods of each part adopt mature bolts, rivets, welding in the prior art , pasting and other conventional means, no longer described in detail here.

[0021] refer to Figure 1-5 , a specific embodiment of the present invention includes a frame 2 fixed on the surface of a computer power supply 1, a number of metal jackets 3 are evenly fixed in the frame 2, a first slide groove 4 is arranged on the edge of the frame 2, and the first groove 4 is inserted into the Connected with a support rod 5, the side of the support rod 5 is provided with a fixing bolt 6, the top of the support rod 5 is fixed with a top cover 7, the bottom surface of the top cover 7 is provided with several metal inner sleeves 8, and the metal inner sleeves 8 are inserted into the metal oute...

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PUM

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Abstract

The invention discloses a cooling device for a computer power supply, which comprises a frame fixed on the surface of the computer power supply, a plurality of metal jackets are uniformly fixed in the frame, a first slide groove is arranged on the edge of the frame, and a support is inserted into the first groove The side of the support rod is provided with fixing bolts, the top of the support rod is fixed with a top cover, and the bottom surface of the top cover is provided with several metal inner sleeves. The inside of the top cover is provided with an air duct communicating with the metal inner casing, the inlet of the air duct is connected with an air inlet pipe, and the side wall of the metal outer casing is provided with several first through holes. The invention can improve the deficiencies of the prior art, improve the matching flexibility of the heat dissipation device, and can adapt to different heat dissipation requirements.

Description

technical field [0001] The invention relates to a computer accessory, in particular to a computer power cooling device. Background technique [0002] When a computer (especially a high-speed mainframe used by a large server) is running, its power module will generate a lot of heat. It is necessary to configure a special heat dissipation device for real-time heat dissipation. In the prior art, heat sinks used in power modules are mainly divided into two categories: the first type is air-cooled heat sinks, which are mainly used for power modules with low power; the second type is water-cooled heat sinks, which are mainly used for power modules with low power. Large power module. Regardless of the type of cooling device, it is matched and installed according to the factory rated power of the computer when the computer is assembled. If the configuration of the computer is upgraded at the user end or the operating environment is relatively special (low temperature / high tempera...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 龚大丰
Owner WENZHOU POLYTECHNIC
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