Composite stack-up release film and preparation method thereof

A release film and composite technology, applied in the direction of chemical instruments and methods, printed circuit manufacturing, synthetic resin layered products, etc., to achieve the effects of reasonable formula, reduced process and reasonable structure

Active Publication Date: 2018-06-29
MATSUMOTO COATING TECH KUNSHAN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem mainly solved by the present invention is to provide a composite laminated release film, which not only has the advantages of good glue resistance, good flow uniformity of the glue layer, and easy tear-off, but also does not contain silicon, is environmentally friendly, and flexible circuit board There will be no secondary pollution

Method used

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  • Composite stack-up release film and preparation method thereof
  • Composite stack-up release film and preparation method thereof
  • Composite stack-up release film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Embodiment 1: A kind of composite laminated release film 100, such as image 3 As shown, it includes an intermediate layer 103, a release layer and a buffer layer whose hardness is lower than that of the intermediate layer 103;

[0053]The intermediate layer 103 is a PE (polyethylene) layer; the intermediate layer 103 has opposite upper and lower surfaces;

[0054] The buffer layer has two layers and is respectively an upper buffer layer 102 and a lower buffer layer 104, and the upper buffer layer 102 and the lower buffer layer 104 are respectively formed on the upper and lower surfaces of the middle layer 103;

[0055] The release layer has two layers and is respectively an upper release layer 101 and a lower release layer 105, and both the upper release layer 101 and the lower release layer 105 are TPX (poly-4-methylpentene) layer; the upper release layer 101 is formed on the upper surface of the upper buffer layer 102, and the upper buffer layer 102 is bonded to the...

Embodiment 2

[0069] Embodiment 2: The structure of this embodiment is the same as that of Embodiment 1, and will not be repeated. The difference is that the middle layer 103 is a PET (polyethylene terephthalate) layer.

[0070] Both the upper buffer layer 102 and the lower buffer layer 104 are made of the following materials (by weight): TPX is 40%; PE is 0%; PP is 20%; EMMA is 40%.

[0071] The thickness of the middle layer is 30 μm, the thickness of the upper buffer layer is 20 μm, the thickness of the lower buffer layer is 60 μm, the thickness of the upper release layer is 20 μm, and the thickness of the lower release layer is 30 μm .

Embodiment 3

[0072] Embodiment 3: The structure of this embodiment is the same as that of Embodiment 1 and will not be repeated. The difference is that the middle layer 103 is a PP layer.

[0073] The upper buffer layer 102 and the lower buffer layer 104 are all made of the following raw materials (by weight): TPX is 30%; PE is 40%; PP is 20%; EMA (ethylene-methyl acrylate copolymer ) is 10%.

[0074] The thickness of the middle layer is 35 μm, the thickness of the upper buffer layer is 50 μm, the thickness of the lower buffer layer is 50 μm, the thickness of the upper release layer is 20 μm, and the thickness of the lower release layer is 20 μm .

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Abstract

The invention discloses a composite stack-up release film comprising a middle layer, two buffer layers and two release layers. The middle layer is a PE layer, a PET layer, a PP layer or a PA layer. The release layers are TPX layers. The hardness of the buffer layers is lower than the hardness of the middle layer. The Vicat softening temperature of the stack-up composed of the buffer layers and therelease layers is 150-170 DEG C. The temperature of the existing FPC lamination process is generally at 160-180 DEG C. During lamination, the release film will be fully softened and will fall down and stick closely along the pits and corners on the surface of a PCB. The filling and fitting effects are excellent. A very good adhesive resisting effect is achieved. The composite stack-up release film has the advantages of good leveling property and easy tearing, contains no silicon, plasticizer or halogen, and is environment-friendly. After the release film is torn off, a flexible printed circuit board will not be contaminated for the second time.

Description

technical field [0001] The invention relates to the technical field of a release film and its preparation, in particular to a composite laminated release film for lamination of a flexible circuit board (FPC). Background technique [0002] Flexible Printed Circuit Board (Flexible Printed Circuit Board) referred to as "soft board", commonly known as FPC in the industry, has many advantages that rigid printed circuit boards do not have, such as it can be bent, wound, and folded freely. The use of FPC can greatly reduce the volume of electronic products, which is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. Therefore, FPC has been widely used in aerospace, military, mobile communications, laptop computers, computer peripherals, handheld computers, digital cameras and other fields or products. [0003] FPC is mainly made of a flexible copper foil substrate and a protective film by high-temperature lam...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28B32B33/00B32B27/06B32B7/06
CPCB32B7/06B32B27/06B32B33/00H05K3/281H05K2203/068
Inventor 陈辉代明水孙守文
Owner MATSUMOTO COATING TECH KUNSHAN CO LTD
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