Method for preparing vanadium dioxide film through magnetron sputtering at low temperature
A technology of vanadium dioxide and magnetron sputtering, which is applied in sputtering coating, metal material coating process, vacuum evaporation coating, etc., can solve the problems of low production efficiency and slow deposition rate, and achieve energy saving, The effect of reducing the preparation temperature and good thermochromic performance
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Embodiment 1
[0040] The substrate is ordinary float glass or quartz glass. The substrate was ultrasonically cleaned with acetone, isopropanol, and deionized water for 5 minutes, then dried with a nitrogen gun, fixed on the sample stage, and placed in a transitional vacuum chamber for vacuuming. The pumping is below 5Pa, and the glass substrate is introduced into the sputtering chamber through the pneumatic transfer rod. Turn on the substrate heating system, heat the glass sheet to 190°C, and keep the temperature constant.
[0041] Cr first 2 o 3 The preparation of the buffer layer, the preparation conditions are as follows: use Cr 2 o 3 Ceramic target, the working atmosphere is high-purity Ar gas (purity higher than 99.999%), injected into the sputtering chamber at a gas flow rate of 50sccm, the working pressure is kept at 0.5Pa, the RF sputtering power is set to 120w, and the sputtering time is 40 Minutes, at this time the Cr on the glass substrate 2 o 3 The thickness is about 30nm...
Embodiment 2
[0044] The substrate is ordinary float glass or quartz glass. The substrate was ultrasonically cleaned with acetone, isopropanol, and deionized water for 5 minutes, then dried with a nitrogen gun, fixed on the sample stage, and placed in a transitional vacuum chamber for vacuuming. The pumping is below 5Pa, and the glass substrate is introduced into the sputtering chamber through the pneumatic transfer rod. Turn on the substrate heating system, heat the glass sheet to 150°C, and keep the temperature constant.
[0045] Cr first 2 o 3 The preparation of the buffer layer, the preparation conditions are as follows: use Cr 2 o 3 Ceramic target, the working atmosphere is high-purity Ar gas (purity higher than 99.999%), injected into the sputtering chamber at a gas flow rate of 50sccm, the working pressure is kept at 0.5Pa, the RF sputtering power is set to 120w, and the sputtering time is 40 Minutes, at this time the Cr on the glass substrate 2 o 3 The thickness is about 30nm...
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