True blind hole circuit board manufacturing process

Abstract

The invention discloses a true blind hole circuit board making process. The process comprises steps that (1), drilling on a front side of a gum base material is carried out, and front side circuit making is carried out; (2), back etching of a copper foil having a protection film on the back side is carried out to make a back side circuit; (3), a back side of the gum base material and a front sideof the copper foil are bonded; (4), the gum base material and the copper foil which are bonded are pressed to synthesize a board body; (5), the protection film on the copper foil is torn; and (6), insulation films are pasted on front and back sides of the board body. The process is advantaged in that the process is simple, the circuits at the back and front sides are produced simultaneously, bonding is then carried out, the integral process steps are effectively and integrally simplified, the production period is greatly shortened, production efficiency is improved, manpower and material resources are effectively saved, production cost is reduced, the back side of the copper foil is supported through employing the protection film, the wrinkle rate of the copper foil is effectively reduced,the yield is improved, product quality is guaranteed, and wide popularization and application are facilitated.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing technology, in particular to a true blind hole circuit board manufacturing process. Background technique [0002] Printed circuit boards are essential components of various electronic products. Existing printed circuit boards use double-sided copper-clad laminates on the copper foil layer for counter-position exposure and development and then etch to make circuits. The specific process steps are roughly as follows: drilling holes on the front side—attaching the copper foil on the back—pressing and curing - Front and back coating, curing - exposure - development - etching, film fading - front and back insulating layers. [0003] Since the above process involves copper foil lamination, since the copper foil is relatively soft, it is easy to cause copper foil wrinkle, which affects the appearance and the yield of post-process exposure products; after lamination, it needs to be cu...

AI Technical Summary

Problems solved by technology

[0003] Since the above process involves copper foil lamination, since the copper foil is relatively soft, it is easy to cause copper foil wrinkle, which affects the appearance and the yield of post-process exposure products; after lamination, it needs to be cured before the next process can be transferred, and the curing takes about 30 minutes. long

Moreover, the coating process has to go through two double-sided coatings. The solvent volatilization during the coating process leads to a poor working environment, and multiple baking is required, which seriously affects the efficiency and production enthusiasm of the operators. In addition, the overall process is various, with curing, coating Processes such as cloth, baking, alignment, exposure, and development are easily affected by equipment and materials, and additional production departments are required, which greatly increases labor costs. It is a labor-intensive and low-efficiency operation method

Images