A kind of manufacturing method of pcb and pcb

Abstract

The invention, which relates to the field of circuit board technology, specifically discloses a manufacturing method of a PCB and a PCB. The manufacturing method comprises: S1, a substrate is provided, a straight slot is formed in the substrate, and thus the side wall of the straight slot is metalized to form a slot wall cooper part; S2, a heat dissipation substrate is provided, a copper layer islaid on the upper surface of the heat dissipation substrate, and a heat dissipation substrate circuit pattern is formed on the copper layer; S3, the heat dissipation substrate is embedded in the straight slot of the substrate and thus the upper surface of the heat dissipation substrate is placed in the straight slot, and the copper layer formed on the upper surface of the heat dissipation substrate is communicated with the slot wall cooper part; and S4, a board circuit pattern is formed on the surface of the substrate and is communicated with the heat dissipation substrate circuit pattern by the slot wall cooper part. In addition, the invention also provides a PCB formed by using the manufacturing method. Therefore, the heat dissipation efficiency of the power component can be improved; the height of the PCB can be reduced effectively; and reliable electrical connection between the power component on the surface of the heat dissipation substrate and the PCB surface circuit pattern is realized.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for manufacturing a PCB and the PCB. Background technique [0002] Due to the rapid development of electronic technology, PCBs are constantly improving in the direction of miniaturization, multi-function, high integration and high power. Therefore, the requirements for PCB heat dissipation performance are getting higher and higher. The current mainstream PCB heat dissipation technologies mainly include metal substrates. (aluminum substrate, copper substrate) technology, ceramic substrate technology, and buried copper block technology. The heat is dissipated in time, thereby reducing the temperature of electrical appliances and equipment, improving the service life of each high-power component and the working performance and reliability of the entire electrical appliance. [0003] However, the problem with the heat dissipation technology of the above-mentioned PCB...

AI Technical Summary

Problems solved by technology

[0003] However, the problem with the heat dissipation technology of the above-mentioned PCB is that when making the PCB, it is necessary to install a metal heat sink on the entire PCB. Due to the large amount of metal used, the overall weight of the PCB is large, and it also increases the complexity of the manufacturing process and process. To a certain extent, for lightweight electronic products, the promotion and use of PCBs using this heat dissipation technology is subject to certain restrictions.

Images